Inventor · disambiguated record
Shunji Hibino
Also filed as: HIBINO SHUNJI
6 granted patents·3 pending applications·61 citations·filing 2000–2008
82Inventor score
Top patents by PatentIndex Score
9 records- 0174US7540078B1Method for recycling wastes of an electrical appliancePANASONIC CORP·Filed 2000·Granted Jun 2, 2009·17 cites·2 claims
- 0268US6657135B2Connection structure and electronic circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 2, 2003·16 cites·22 claims
- 0367US6702175B1Method of soldering using lead-free solder and bonded article prepared through soldering by the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 9, 2004·12 cites·14 claims
- 0465US6805282B2Flow soldering process and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 19, 2004·12 cites·8 claims
- 0554US2008210604A1Article having a circuit soldered with parts and method for recycling wastes of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 0650US7047635B2Connecting material and connecting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 23, 2006·3 cites·64 claims
- 0744US6607116B2Method and apparatus for estimating quality of lead-free solder material and process and system for flow solderingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 19, 2003·1 cites·19 claims
- 0837US2004144829A1Method of soldering lead-free solder, and joined object soldered by the soldering methodFiled 2004·Application pending·0 cites
- 0933US2002179690A1Flux applying method, flow soldering method and devices therefor and electronic circuit boardFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →