Inventor · disambiguated record
John M. Yamartino
Also filed as: YAMARTINO JOHN · YAMARTINO JOHN M
11 granted patents·4 pending applications·771 citations·filing 1998–2012
92Inventor score
Top patents by PatentIndex Score
15 records- 0197US6673199B1Shaping a plasma with a magnetic field to control etch rate uniformityAPPLIED MATERIALS INC·Filed 2001·Granted Jan 6, 2004·107 cites·39 claims
- 0296US6352049B1Plasma assisted processing chamber with separate control of species densityAPPLIED MATERIALS INC·Filed 1998·Granted Mar 5, 2002·498 cites·24 claims
- 0389US6085688AMethod and apparatus for improving processing and reducing charge damage in an inductively coupled plasma reactorAPPLIED MATERIALS INC·Filed 1998·Granted Jul 11, 2000·52 cites·54 claims
- 0488US6247425B1Method and apparatus for improving processing and reducing charge damage in an inductively coupled plasma reactorAPPLIED MATERIALS INC·Filed 2000·Granted Jun 19, 2001·28 cites·25 claims
- 0582US6569775B1Method for enhancing plasma processing performanceAPPLIED MATERIALS INC·Filed 2000·Granted May 27, 2003·28 cites·28 claims
- 0680US7624003B2Split-phase chamber modeling for chamber matching and fault detectionAPPLIED MATERIALS INC·Filed 2005·Granted Nov 24, 2009·11 cites·34 claims
- 0778US8257546B2Method and system for monitoring an etch processDAVIS MATTHEW FENTON·Filed 2003·Granted Sep 4, 2012·23 cites·37 claims
- 0861US8676367B2Lot process order modification to improve detection of manufacturing effectsYAMARTINO JOHN M·Filed 2010·Granted Mar 18, 2014·2 cites·15 claims
- 0948US6566272B2Method for providing pulsed plasma during a portion of a semiconductor wafer processAPPLIED MATERIALS INC·Filed 1999·Granted May 20, 2003·14 cites·13 claims
- 1047US8010225B2Method and system of monitoring manufacturing equipmentIBM·Filed 2008·Granted Aug 30, 2011·0 cites·20 claims
- 1146US2012291952A1Method and system for monitoring an etch processDAVIS MATTHEW FENTON·Filed 2012·Application pending·0 cites
- 1246US2009061544A1Trajectory based control of plasma processingAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1337US6635577B1Method for reducing topography dependent charging effects in a plasma enhanced semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1999·Granted Oct 21, 2003·8 cites·21 claims
- 1436US2011168671A1Process control using signal representative of a throttle valve positionIBM·Filed 2010·Application pending·0 cites
- 1535US2007051471A1Methods and apparatus for strippingAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →