Assignee
UNITED TEST AND ASSEMBLY TEST
SG·1 granted patent·2 pending applications·12 citations·filing 2003–2009
Top patents by PatentIndex Score
3 records- 0152US7109570B2Integrated circuit package with leadframe enhancement and method of manufacturing the sameUNITED TEST AND ASSEMBLY TEST·Filed 2004·Granted Sep 19, 2006·12 cites·6 claims
- 0233US2004124508A1High performance chip scale leadframe package and method of manufacturing the packageUNITED TEST AND ASSEMBLY TEST·Filed 2003·Application pending·0 cites
- 0329US2009266807A1Oven control systemUNITED TEST AND ASSEMBLY TEST·Filed 2009·Application pending·0 cites
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