Individual holder
LAM KEN M
US·8 granted patents·1 pending application·5 citations·filing 2005–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
9 records- 0169US8258599B2Electronics package with an integrated circuit device having post wafer fabrication integrated passive componentsLAM KEN M·Filed 2006·Granted Sep 4, 2012·4 cites·8 claims
- 0260US8860195B2Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit packageLAM KEN M·Filed 2009·Granted Oct 14, 2014·1 cites·13 claims
- 0354US8568822B2Apparatus and method incorporating discrete passive components in an electronic packageLAM KEN M·Filed 2007·Granted Oct 29, 2013·0 cites·12 claims
- 0453US8525329B2Component stacking for integrated circuit electronic packageLAM KEN M·Filed 2012·Granted Sep 3, 2013·0 cites·13 claims
- 0548US8531022B2Routable array metal integrated circuit packageLAM KEN M·Filed 2009·Granted Sep 10, 2013·0 cites·19 claims
- 0648US8264075B2Stacked-die package including substrate-ground couplingLAM KEN M·Filed 2010·Granted Sep 11, 2012·0 cites·9 claims
- 0747US8429814B2Method of assembling a multi-component electronic packageLAM KEN M·Filed 2010·Granted Apr 30, 2013·0 cites·11 claims
- 0847US8278150B2Stackable packages for three-dimensional packaging of semiconductor diceLAM KEN M·Filed 2010·Granted Oct 2, 2012·0 cites·20 claims
- 0946US2007138628A1Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit packageLAM KEN M·Filed 2005·Application pending·0 cites
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