Assignee
HAMADA YOICHIRO
JP·2 granted patents·1 pending application·1 citations·filing 2010–2013
Top patents by PatentIndex Score
3 records- 0152US8188588B2Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor packageHAMADA YOICHIRO·Filed 2010·Granted May 29, 2012·1 cites·4 claims
- 0243US9054116B2Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor packageHAMADA YOICHIRO·Filed 2013·Granted Jun 9, 2015·0 cites·8 claims
- 0337US2012064666A1Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor packageHAMADA YOICHIRO·Filed 2011·Application pending·0 cites
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