Assignee
DONG WEN-CHANG
4 granted patents·2 pending applications·35 citations·filing 2005–2007
Top patents by PatentIndex Score
6 records- 0191US7388388B2Thin film with MEMS probe circuits and MEMS thin film probe head using the sameDONG WEN-CHANG·Filed 2005·Granted Jun 17, 2008·27 cites·12 claims
- 0270US7351602B2Process for producing a thin film with MEMS probe circuitsDONG WEN-CHANG·Filed 2005·Granted Apr 1, 2008·6 cites·7 claims
- 0358US7445956B2Flexible MEMS thin film without manufactured substrate and process for producing the sameDONG WEN-CHANG·Filed 2005·Granted Nov 4, 2008·1 cites·5 claims
- 0447US7414419B2Micro-electromechanical probe circuit substrateDONG WEN-CHANG·Filed 2006·Granted Aug 19, 2008·1 cites·6 claims
- 0545US2007249153A1Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the sameDONG WEN-CHANG·Filed 2007·Application pending·0 cites
- 0645US2007246837A1IC chip package with minimized packaged-volumeDONG WEN-CHANG·Filed 2007·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →