Assignee
DIAMOND FOUNDRY INC
US·2 granted patents·9 pending applications·0 citations·filing 2018–2025
Top patents by PatentIndex Score
11 records- 0161US12581707B2Diamond wafer based electronic vehicle power electronicsDIAMOND FOUNDRY INC·Filed 2023·Granted Mar 17, 2026·0 cites·34 claims
- 0261US2025389027A1Direct diffusion bonding of materials with surface treatmentDIAMOND FOUNDRY INC·Filed 2025·Application pending·0 cites
- 0359US2026076198A1Multi-chiplets packaging for jet-cooled, diamond-substrated chipsDIAMOND FOUNDRY INC·Filed 2025·Application pending·0 cites
- 0458US2025105089A1Hotspot-free semiconductor device chipsDIAMOND FOUNDRY INC·Filed 2024·Application pending·0 cites
- 0557US2026076190A1Reconstituted wafer product with variable thickness dies containing diamondDIAMOND FOUNDRY INC·Filed 2025·Application pending·0 cites
- 0657US2026076187A1Single Crystal Diamond Dies Packaged with Ultrathin Semiconductor WaferDIAMOND FOUNDRY INC·Filed 2025·Application pending·0 cites
- 0757US2026076188A1Single Crystal Diamond Dies Packaged with Ultrathin Pocketed Semiconductor WaferDIAMOND FOUNDRY INC·Filed 2025·Application pending·0 cites
- 0857US2026076189A1Single Crystal Diamond Dies Packaged with Ultrathin Pocketed Semiconductor WaferDIAMOND FOUNDRY INC·Filed 2025·Application pending·0 cites
- 0948US2025309024A1Electronic Device Component with Improved Thermal CharacteristicsDIAMOND FOUNDRY INC·Filed 2025·Application pending·0 cites
- 1046US11261522B2Axisymmetric material deposition from plasma assisted by angled gas flowDIAMOND FOUNDRY INC·Filed 2018·Granted Mar 1, 2022·0 cites·18 claims
- 1145US2025357263A1Composite thermal hotspot management in die packagingDIAMOND FOUNDRY INC·Filed 2025·Application pending·0 cites
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