Assignee
TREZZA JOHN
34 granted patents·7 pending applications·994 citations·filing 2001–2011
Top patents by PatentIndex Score
41 records- 0199US7803693B2Bowed wafer hybridization compensationTREZZA JOHN·Filed 2007·Granted Sep 28, 2010·219 cites·22 claims
- 0299US7538033B2Post-attachment chip-to-chip connectionTREZZA JOHN·Filed 2006·Granted May 26, 2009·44 cites·17 claims
- 0399US7521806B2Chip spanning connectionTREZZA JOHN·Filed 2006·Granted Apr 21, 2009·201 cites·20 claims
- 0499US7482272B2Through chip connectionTREZZA JOHN·Filed 2006·Granted Jan 27, 2009·75 cites·27 claims
- 0598US8283778B2Thermally balanced viaTREZZA JOHN·Filed 2007·Granted Oct 9, 2012·38 cites·20 claims
- 0698US8093729B2Electrically conductive interconnect system and methodTREZZA JOHN·Filed 2007·Granted Jan 10, 2012·37 cites·50 claims
- 0798US7808111B2Processed wafer viaTREZZA JOHN·Filed 2006·Granted Oct 5, 2010·48 cites·47 claims
- 0898US7659202B2Triaxial through-chip connectionTREZZA JOHN·Filed 2007·Granted Feb 9, 2010·40 cites·22 claims
- 0998US7534722B2Back-to-front via processTREZZA JOHN·Filed 2006·Granted May 19, 2009·70 cites·20 claims
- 1097US7786592B2Chip capacitive couplingTREZZA JOHN·Filed 2006·Granted Aug 31, 2010·56 cites·27 claims
- 1195US8067312B2Coaxial through chip connectionTREZZA JOHN·Filed 2010·Granted Nov 29, 2011·10 cites·30 claims
- 1294US8154131B2Profiled contactTREZZA JOHN·Filed 2006·Granted Apr 10, 2012·12 cites·15 claims
- 1393US7838997B2Remote chip attachmentTREZZA JOHN·Filed 2006·Granted Nov 23, 2010·25 cites·33 claims
- 1492US7687397B2Front-end processed wafer having through-chip connectionsTREZZA JOHN·Filed 2007·Granted Mar 30, 2010·24 cites·17 claims
- 1591US7847412B2Isolating chip-to-chip contactTREZZA JOHN·Filed 2006·Granted Dec 7, 2010·13 cites·30 claims
- 1691US7767493B2Post & penetration interconnectionTREZZA JOHN·Filed 2006·Granted Aug 3, 2010·14 cites·22 claims
- 1787US8846445B2Inverse chip connectorTREZZA JOHN·Filed 2011·Granted Sep 30, 2014·3 cites·23 claims
- 1887US7785987B2Isolating chip-to-chip contactTREZZA JOHN·Filed 2009·Granted Aug 31, 2010·8 cites·21 claims
- 1985US7781886B2Electronic chip contact structureTREZZA JOHN·Filed 2006·Granted Aug 24, 2010·13 cites·24 claims
- 2084US8232194B2Process for chip capacitive couplingTREZZA JOHN·Filed 2011·Granted Jul 31, 2012·5 cites·27 claims
- 2184US7560813B2Chip-based thermo-stackTREZZA JOHN·Filed 2006·Granted Jul 14, 2009·10 cites·32 claims
- 2277US8456015B2Triaxial through-chip connectionTREZZA JOHN·Filed 2010·Granted Jun 4, 2013·4 cites·37 claims
- 2376US9147635B2Contact-based encapsulationTREZZA JOHN·Filed 2010·Granted Sep 29, 2015·1 cites·28 claims
- 2476US8399820B2Multicolor detectors and applications thereofTREZZA JOHN·Filed 2009·Granted Mar 19, 2013·3 cites·21 claims
- 2575US8197626B2Rigid-backed, membrane-based chip toolingTREZZA JOHN·Filed 2011·Granted Jun 12, 2012·1 cites·27 claims
- 2674US7670874B2Plated pillar package formationTREZZA JOHN·Filed 2007·Granted Mar 2, 2010·3 cites·24 claims
- 2767US7748116B2Mobile binding in an electronic connectionTREZZA JOHN·Filed 2007·Granted Jul 6, 2010·3 cites·19 claims
- 2865US7831151B2Redundant optical device arrayTREZZA JOHN·Filed 2001·Granted Nov 9, 2010·8 cites·51 claims
- 2965US7785931B2Chip-based thermo-stackTREZZA JOHN·Filed 2009·Granted Aug 31, 2010·2 cites·37 claims
- 3064US7687400B2Side stacking apparatus and methodTREZZA JOHN·Filed 2007·Granted Mar 30, 2010·2 cites·32 claims
- 3162US8084851B2Side stacking apparatus and methodTREZZA JOHN·Filed 2010·Granted Dec 27, 2011·1 cites·51 claims
- 3261US8197627B2Pin-type chip toolingTREZZA JOHN·Filed 2011·Granted Jun 12, 2012·0 cites·34 claims
- 3359US7850060B2Heat cycle-able connectionTREZZA JOHN·Filed 2007·Granted Dec 14, 2010·1 cites·24 claims
- 3457US2011275178A1Patterned contactTREZZA JOHN·Filed 2011·Application pending·0 cites
- 3556US2009174079A1Plated pillar package formationTREZZA JOHN·Filed 2009·Application pending·0 cites
- 3656US2012108009A1Electrically conductive interconnect system and methodTREZZA JOHN·Filed 2011·Application pending·0 cites
- 3755US8643186B2Processed wafer viaTREZZA JOHN·Filed 2010·Granted Feb 4, 2014·0 cites·32 claims
- 3853US2009267219A1Ultra-thin chip packagingTREZZA JOHN·Filed 2009·Application pending·0 cites
- 3945US2008261392A1Conductive via formationTREZZA JOHN·Filed 2007·Application pending·0 cites
- 4041US2006278996A1Active packagingTREZZA JOHN·Filed 2006·Application pending·0 cites
- 4141US2006281303A1Tack & fuse chip bondingTREZZA JOHN·Filed 2006·Application pending·0 cites
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