Assignee
ROCKWOOD ELECTROCHEMICALS ASIA
TW·0 granted patents·2 pending applications·0 citations·filing 2006–2006
Top patents by PatentIndex Score
2 records- 0138US2007215479A1Method for monitoring the filling performance of copper plating formula for microvia fillingROCKWOOD ELECTROCHEMICALS ASIA·Filed 2006·Application pending·0 cites
- 0238US2007215490A1Method of analyzing accelerator for copper electroplatingROCKWOOD ELECTROCHEMICALS ASIA·Filed 2006·Application pending·0 cites
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