Assignee
HUANG CHENG-YEN
0 granted patents·8 pending applications·0 citations·filing 2004–2012
Top patents by PatentIndex Score
8 records- 0148US2008003714A1Chip-packaging with bonding options connected to a package substrateHUANG CHENG-YEN·Filed 2007·Application pending·0 cites
- 0242US2014032202A1Apparatus of system level simulation and emulation, and associated methodHUANG CHENG-YEN·Filed 2012·Application pending·0 cites
- 0341US2013126150A1Fan control system and methodHUANG CHENG-YEN·Filed 2011·Application pending·0 cites
- 0441US2006242368A1Method of Queuing and Related ApparatusHUANG CHENG-YEN·Filed 2005·Application pending·0 cites
- 0539US2005248028A1Chip-packaging with bonding options connected to a package substrateHUANG CHENG-YEN·Filed 2004·Application pending·0 cites
- 0639US2012143583A1System-level emulation/verification system and system-level emulation/verification methodHUANG CHENG-YEN·Filed 2010·Application pending·0 cites
- 0736US2013128438A1Heat dissipating systemHUANG CHENG-YEN·Filed 2012·Application pending·0 cites
- 0835US2013131885A1System and method for obtaining and managing temperature dataHUANG CHENG-YEN·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →