Assignee
HASHIMOTO NOBUAKI
JP·25 granted patents·5 pending applications·10 citations·filing 2004–2012
Top patents by PatentIndex Score
30 records- 0180US8610578B2Electronic substrate, semiconductor device, and electronic deviceHASHIMOTO NOBUAKI·Filed 2010·Granted Dec 17, 2013·3 cites·8 claims
- 0276US8855733B2Substance component detection deviceHASHIMOTO NOBUAKI·Filed 2012·Granted Oct 7, 2014·2 cites·9 claims
- 0376US8465138B2Semiconductor device, ink cartridge, and electronic deviceHASHIMOTO NOBUAKI·Filed 2012·Granted Jun 18, 2013·1 cites·8 claims
- 0466US8284566B2Electronic substrateHASHIMOTO NOBUAKI·Filed 2010·Granted Oct 9, 2012·1 cites·19 claims
- 0566US8106304B2Mounting structure of electronic componentHASHIMOTO NOBUAKI·Filed 2008·Granted Jan 31, 2012·2 cites·10 claims
- 0662US8097817B2Electronic componentHASHIMOTO NOBUAKI·Filed 2010·Granted Jan 17, 2012·1 cites·6 claims
- 0756US8552310B2Mounting structure of electronic componentHASHIMOTO NOBUAKI·Filed 2012·Granted Oct 8, 2013·0 cites·10 claims
- 0856US8310057B2Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentHASHIMOTO NOBUAKI·Filed 2010·Granted Nov 13, 2012·0 cites·6 claims
- 0955US8134237B2Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit boardHASHIMOTO NOBUAKI·Filed 2011·Granted Mar 13, 2012·0 cites·11 claims
- 1055US8115284B2Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrumentHASHIMOTO NOBUAKI·Filed 2011·Granted Feb 14, 2012·0 cites·16 claims
- 1154US8399999B2Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrumentHASHIMOTO NOBUAKI·Filed 2011·Granted Mar 19, 2013·0 cites·20 claims
- 1254US8231197B2Semiconductor device, ink cartridge, and electronic deviceHASHIMOTO NOBUAKI·Filed 2010·Granted Jul 31, 2012·0 cites·6 claims
- 1353US8274201B2Electronic component, mounting structure thereof, and method for mounting electronic componentHASHIMOTO NOBUAKI·Filed 2011·Granted Sep 25, 2012·0 cites·5 claims
- 1452US8227914B2Mounting structure of electronic componentHASHIMOTO NOBUAKI·Filed 2008·Granted Jul 24, 2012·0 cites·9 claims
- 1552US2012052634A1Method of manufacturing semiconductor device including exposing a dicing line on a waferHASHIMOTO NOBUAKI·Filed 2011·Application pending·0 cites
- 1651US8664730B2Manufacturing method for electronic component, electronic component, and electronic equipmentHASHIMOTO NOBUAKI·Filed 2010·Granted Mar 4, 2014·0 cites·13 claims
- 1751US8178968B2Electronic componentHASHIMOTO NOBUAKI·Filed 2008·Granted May 15, 2012·0 cites·4 claims
- 1851US8110245B2Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrumentHASHIMOTO NOBUAKI·Filed 2006·Granted Feb 7, 2012·0 cites·6 claims
- 1951US8080447B2Method of manufacturing semiconductor device including exposing a dicing line on a waferHASHIMOTO NOBUAKI·Filed 2010·Granted Dec 20, 2011·0 cites·5 claims
- 2050US8416578B2Manufacturing method for an electronic substrateHASHIMOTO NOBUAKI·Filed 2010·Granted Apr 9, 2013·0 cites·2 claims
- 2149US8497432B2Electronic component mounting structureHASHIMOTO NOBUAKI·Filed 2009·Granted Jul 30, 2013·0 cites·9 claims
- 2249US2006055036A1Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor deviceHASHIMOTO NOBUAKI·Filed 2005·Application pending·0 cites
- 2348US8191247B2Electronic board, method of manufacturing the same, and electronic deviceHASHIMOTO NOBUAKI·Filed 2010·Granted Jun 5, 2012·0 cites·8 claims
- 2448US8115309B2Semiconductor deviceHASHIMOTO NOBUAKI·Filed 2010·Granted Feb 14, 2012·0 cites·18 claims
- 2548US8102099B2Electronic component, mounting structure thereof, and method for mounting electronic componentHASHIMOTO NOBUAKI·Filed 2010·Granted Jan 24, 2012·0 cites·5 claims
- 2646US8143728B2Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatusHASHIMOTO NOBUAKI·Filed 2006·Granted Mar 27, 2012·0 cites·8 claims
- 2746US8138612B2Semiconductor deviceHASHIMOTO NOBUAKI·Filed 2010·Granted Mar 20, 2012·0 cites·1 claims
- 2845US2012236301A1Measurement apparatus and measurement methodHASHIMOTO NOBUAKI·Filed 2012·Application pending·0 cites
- 2941US2005230042A1Bonding structure and method for bonding membersHASHIMOTO NOBUAKI·Filed 2004·Application pending·0 cites
- 3041US2006049527A1Electronic device and method of manufacturing the sameHASHIMOTO NOBUAKI·Filed 2005·Application pending·0 cites
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