Assignee
GLOBAL CIRCUIT INNOVATIONS INC
US·5 granted patents·1 pending application·0 citations·filing 2017–2022
Top patents by PatentIndex Score
6 records- 0172US11978711B2Solder ball application for singular dieGLOBAL CIRCUIT INNOVATIONS INC·Filed 2022·Granted May 7, 2024·0 cites·12 claims
- 0264US11508680B2Solder ball application for singular dieGLOBAL CIRCUIT INNOVATIONS INC·Filed 2020·Granted Nov 22, 2022·0 cites·7 claims
- 0364US11077654B2Conductive diamond application systemGLOBAL CIRCUIT INNOVATIONS INC·Filed 2020·Granted Aug 3, 2021·0 cites·10 claims
- 0448US11257726B2Low profile integrated circuitGLOBAL CIRCUIT INNOVATIONS INC·Filed 2020·Granted Feb 22, 2022·0 cites·17 claims
- 0544US11618951B2Chemical evaporation control systemGLOBAL CIRCUIT INNOVATIONS INC·Filed 2020·Granted Apr 4, 2023·0 cites·20 claims
- 0631US2019122897A1Low Profile Electronic System Method and ApparatusGLOBAL CIRCUIT INNOVATIONS INC·Filed 2017·Application pending·0 cites
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