Solder ball application for singular die

Abstract

A method is provided. The method includes one or more of conditioning one or more die pads of a singular die, applying a nickel layer to the one or more die pads, applying a gold layer over the nickel layer, applying a solder paste over the gold layer, applying one or more solder balls to the solder paste, and mating the one or more solder balls to one or more bond pads of another die, a printed circuit board, or a substrate.

I claim: 
     
       1. A method comprising:
 conditioning one or more die pads of a singular die; 
 applying a nickel layer to the one or more die pads; 
 applying a gold layer over the nickel layer; 
 applying a solder paste over the gold layer; 
 applying one or more solder balls to the solder paste; 
 mating the one or more solder balls to one or more bond pads of another die, a printed circuit board, or a substrate; and 
 soldering the singular die to the other die, the printed circuit board, or the substrate by baking the singular die mated to the other die, the printed circuit board, or the substrate using a thermal profile. 
 
     
     
       2. The method of  claim 1 , wherein conditioning the one or more die pads comprises:
 removing one or more of metallic residue and chemical deposits from the one or more die pads. 
 
     
     
       3. The method of  claim 1 , wherein the singular die comprises an extracted die removed from an integrated circuit package, wherein prior to conditioning the one or more die pads the method comprises:
 removing one or more of ball bonds and bond wires from die pads of the extracted die, wherein the extracted die comprises a fully functional semiconductor die with one or more ball bonds on the one or more die pads. 
 
     
     
       4. The method of  claim 3 , wherein only die pads of the extracted die previously having a ball bond are conditioned. 
     
     
       5. The method of  claim 1 , further comprising:
 applying a palladium layer over the nickel layer; and 
 applying the gold layer over the palladium layer instead of over the nickel layer. 
 
     
     
       6. The method of  claim 5 , wherein applying the nickel layer, applying the palladium layer, and applying the gold layer comprises:
 3D printing, by a 3D printer, the nickel layer to the one or more die pads; 
 3D printing the palladium layer over the nickel layer; and 
 3D printing the gold layer over the palladium layer. 
 
     
     
       7. The method of  claim 1 , wherein a diameter of the solder balls is equal to or less than a width of the one or more die pads and the one or more bond pads.