Assignee
CHIPMOS TECHNOLOGY INC
TW·2 granted patents·2 pending applications·6 citations·filing 2007–2010
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0168US7884486B2Chip-stacked package structure and method for manufacturing the sameCHIPMOS TECHNOLOGY INC·Filed 2009·Granted Feb 8, 2011·4 cites·28 claims
- 0261US7696629B2Chip-stacked package structureCHIPMOS TECHNOLOGY INC·Filed 2007·Granted Apr 13, 2010·2 cites·13 claims
- 0347US2008265400A1Chip-Stacked Package Structure and Applications ThereofCHIPMOS TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 0442US2010155929A1Chip-Stacked Package StructureCHIPMOS TECHNOLOGY INC·Filed 2010·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →