Flexible display having a crack suppressing layer

Abstract

A flexible display may suppress a generation of cracks in an inorganic layer and suppress the spread of cracks. A flexible display includes a flexible substrate and an inorganic layer formed on the flexible substrate. A display unit is formed on the inorganic layer. The display unit includes a plurality of pixels. Each pixel includes an organic light emitting diode. A thin film encapsulation layer covers the display unit. A crack suppressing layer is formed along the edge of the flexible substrate. The crack suppressing layer is disposed on the inorganic layer at an exterior side of the thin film encapsulation layer.

What is claimed is: 
     
       1. A flexible display, comprising:
 a flexible substrate;   an inorganic layer disposed on the flexible substrate, wherein the inorganic layer comprises a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer;   a display unit disposed on the inorganic layer, wherein the display unit includes a plurality of pixels, each pixel thereof including an organic light emitting diode;   a thin film encapsulation layer covering the display unit; and   a crack suppressing layer formed along an edge of the flexible substrate, wherein the crack suppressing layer is disposed directly on the interlayer insulating layer of the inorganic layer at an exterior side of the thin film encapsulation layer, wherein the crack suppressing layer is configured to contact the edge of the flexible substrate, and the crack suppressing layer is disposed at an uppermost edge of the flexible substrate.   
     
     
       2. The flexible display of  claim 1 , wherein the barrier layer, the buffer layer, the gate insulating layer, and the interlayer insulating layer cover an entire top surface of the flexible substrate. 
     
     
       3. The flexible display of  claim 1 , wherein the barrier layer and the buffer layer cover an entire top surface of the flexible substrate, and the gate insulating layer and the interlayer insulating layer are disposed at an interior side of the crack suppressing layer, and the gate insulating layer and the interlayer insulating layer are disposed at a constant distance from the edge of the flexible substrate. 
     
     
       4. The flexible display of  claim 1 , wherein the barrier layer and the buffer layer cover an entire top surface of the flexible substrate, and the gate insulating layer and the interlayer insulating layer are disposed at an inner side of the crack suppressing layer at a constant distance from the edge of the flexible substrate. 
     
     
       5. The flexible display of  claim 1 , wherein the barrier layer, the buffer layer, the gate insulating layer, and the interlayer insulating layer are formed at an inner side of the crack suppressing layer between the edge of the flexible substrate and the crack suppressing layer. 
     
     
       6. The flexible display of  claim 1 , wherein the crack suppressing layer comprises an organic material. 
     
     
       7. The flexible display of  claim 6 , wherein the display unit comprises a planarization layer and a pixel defining layer, and the crack suppressing layer comprises a same material as the planarization layer or the pixel defining layer. 
     
     
       8. The flexible display of  claim 7 , wherein the crack suppressing layer comprises a first layer including a same material as the planarization layer and a second layer including a same material as the pixel defining layer. 
     
     
       9. The flexible display of  claim 6 , wherein the crack suppressing layer comprises at least one of a UV curable resin and a thermosetting resin. 
     
     
       10. A display device, comprising:
 a flexible substrate;   an inorganic layer disposed on a portion of the flexible substrate, wherein the inorganic layer comprises a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer, and wherein a portion of the flexible substrate is not covered by the inorganic layer;   a thin film encapsulation layer disposed over a display unit, wherein the display unit is disposed on the inorganic layer; and   a crack suppressing layer formed over the portion of the flexible substrate not covered by the inorganic layer, wherein the crack suppressing layer is disposed directly on the inorganic layer and the crack suppressing layer covers a side portion of the inorganic layer comprising the barrier layer, the buffer layer, the gate insulating layer and the interlayer insulating layer, and a top portion of the inorganic layer, wherein the crack suppressing layer is configured to prevent cracks from forming in the inorganic layer during a cutting process, wherein the crack suppressing layer is configured to contact the edge of the flexible substrate, and the crack suppressing layer is disposed at an uppermost edge of the flexible substrate.   
     
     
       11. The display of  claim 10 , further comprising an upper protection film disposed on the thin film encapsulation layer. 
     
     
       12. The display of  claim 10 , wherein the crack suppressing layer comprises a first layer and a second layer. 
     
     
       13. The display of  claim 10 , wherein the crack suppressing layer comprises a UV curable resin or a thermosetting resin. 
     
     
       14. The display of  claim 10 , wherein the crack suppressing layer comprises a sealant. 
     
     
       15. A flexible display, comprising:
 a flexible substrate;   an inorganic layer disposed on the flexible substrate, wherein the inorganic layer comprises a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer;   a display unit disposed on the inorganic layer, wherein the display unit includes a plurality of pixels, each pixel thereof including an organic light emitting diode;   a thin film encapsulation layer covering the display unit; and   a crack suppressing layer formed along an edge of the flexible substrate, wherein the crack suppressing layer is disposed directly on the interlayer insulating layer of the inorganic layer at an exterior side of the thin film encapsulation layer, and wherein the crack suppressing layer is formed at an inner side of the flexible substrate, and the crack suppressing layer covers a portion of the inorganic layer.   
     
     
       16. The flexible display of  claim 15 , wherein the barrier layer and the buffer layer cover an entire top surface of the flexible substrate, and the gate insulating layer and the interlayer insulating layer are disposed at an inner side of the crack suppressing layer at a constant distance from the edge of the flexible substrate. 
     
     
       17. The flexible display of  claim 15 , wherein the barrier layer, the buffer layer, the gate insulating layer, and the interlayer insulating layer are formed at an inner side of the crack suppressing layer between the edge of the flexible substrate and the crack suppressing layer. 
     
     
       18. A flexible display, comprising:
 a flexible substrate;   a transistor disposed on the flexible substrate and including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode;   a plurality of inorganic layers including a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer sequentially disposed on the flexible substrate;   a light emitting element disposed on the interlayer insulating layer and electrically connected to the transistor;   a thin film encapsulation layer covering the light emitting element; and   a crack suppressing layer disposed directly on the interlayer insulating layer and along an edge of the flexible substrate,   wherein at least one of the barrier layer and the buffer layer is disposed at the edge of the flexible substrate,   wherein at least one of an edge of the gate insulating layer and an edge of the interlayer insulating layer is spaced apart from the edge of the flexible substrate.    
     
     
       19. The flexible display of claim 18, wherein:
 edges of the gate insulating layer and the interlayer insulating layer are spaced apart from the edge of the flexible substrate.    
     
     
       20. The flexible display of claim 18, wherein:
 the at least one of the barrier layer and the buffer layer extends from a display area of the flexible substrate where the light emitting element is disposed to the edge of the flexible substrate.    
     
     
       21. The flexible display of claim 18, wherein:
 the crack suppressing layer is in contact with at least one of a lateral side of the gate insulating layer and a lateral side of the interlayer insulating layer.    
     
     
       22. The flexible display of claim 18, wherein:
 the crack suppressing layer is spaced apart from the edge of the flexible substrate.    
     
     
       23. The flexible display of claim 18, wherein:
 a height of the crack suppressing layer with reference to the flexible substrate is smaller than a height of the thin film encapsulation layer with reference to the flexible substrate.    
     
     
       24. The flexible display of claim 18, wherein:
 the barrier layer and the buffer layer are disposed between the flexible substrate and the semiconductor layer,   the gate insulating layer is disposed between the semiconductor layer and the gate electrode, and   the interlayer insulating layer is disposed between the gate electrode and the source electrode.    
     
     
       25. The flexible display of claim 18, wherein:
 the light emitting element includes a first electrode electrically connected to the transistor, an emission layer disposed on the first electrode, and a second electrode disposed on the emission layer, the flexible display further comprising:   a first organic layer disposed between the interlayer insulating layer and the light emitting element; and   a second organic layer disposed between the first organic layer and the second electrode and including an opening that overlaps at least a portion of the first electrode, and   the crack suppressing layer comprises a same material as at least one of the first organic layer and the second organic layer.    
     
     
       26. A flexible display, comprising:
 a flexible substrate;   a transistor disposed on the flexible substrate;   a plurality of inorganic layers including a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer sequentially disposed on the flexible substrate;   a light emitting element disposed on the interlayer insulating layer and electrically connected to the transistor;   a thin film encapsulation layer covering the light emitting element; and   an organic material layer disposed directly on the interlayer insulating layer and along an edge of the flexible substrate,   wherein at least one of the barrier layer and the buffer layer is disposed at the edge of the flexible substrate,   wherein a height of the organic material layer with reference to the flexible substrate is smaller than a height of the thin film encapsulation layer with reference to the flexible substrate.    
     
     
       27. The flexible display of claim 26, wherein:
 at least one of an edge of the gate insulating layer and an edge of the interlayer insulating layer is spaced apart from the edge of the flexible substrate.    
     
     
       28. The flexible display of claim 26, wherein:
 the at least one of the barrier layer and the buffer layer extends from a display area of the flexible substrate where the light emitting element is disposed to the edge of the flexible substrate.    
     
     
       29. The flexible display of claim 26, wherein:
 the organic material layer is in contact with at least one of a lateral side of the gate insulating layer and a lateral side of the interlayer insulating layer.    
     
     
       30. The flexible display of claim 26, wherein:
 the organic material layer is spaced apart from the edge of the flexible substrate.    
     
     
       31. The flexible display of claim 26, wherein:
 the light emitting element includes a first electrode electrically connected to the transistor, an emission layer disposed on the first electrode, and a second electrode disposed on the emission layer, the flexible display further comprising:   a first organic layer disposed between the interlayer insulating layer and the light emitting element; and   a second organic layer disposed between the first organic layer and the second electrode and including an opening that overlaps at least a portion of the first electrode, and   the organic material layer comprises a same material as at least one of the first organic layer and the second organic layer.    
     
     
       32. A flexible display, comprising:
 a flexible substrate;   a transistor disposed on the flexible substrate;   a plurality of inorganic layers including a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer sequentially disposed on the flexible substrate;   a light emitting element disposed on the interlayer insulating layer and electrically connected to the transistor;   a thin film encapsulation layer covering the light emitting element; and   an organic material layer disposed directly on the interlayer insulating layer and along an edge of the flexible substrate,   wherein at least one of the barrier layer and the buffer layer is disposed at the edge of the flexible substrate,   wherein the organic material layer is spaced apart from the thin film encapsulation layer, and   at least upper surface of the organic material layer is exposed.    
     
     
       33. The flexible display of claim 32, wherein:
 at least one of an edge of the gate insulating layer and an edge of the interlayer insulating layer is spaced apart from the edge of the flexible substrate.    
     
     
       34. The flexible display of claim 32, wherein:
 the at least one of the barrier layer and the buffer layer extends from a display area of the flexible substrate where the light emitting element is disposed to the edge of the flexible substrate.    
     
     
       35. The flexible display of claim 32, wherein:
 the organic material layer is in contact with at least one of a lateral side of the gate insulating layer and a lateral side of the interlayer insulating layer.    
     
     
       36. The flexible display of claim 32, wherein:
 the organic material layer is spaced apart from the edge of the flexible substrate.    
     
     
       37. The flexible display of claim 32, wherein:
 a height of the organic material layer with reference to the flexible substrate is smaller than a height of the thin film encapsulation layer with reference to the flexible substrate.