USRE48540EActiveUtility

Flexible display having a crack suppressing layer

Assignee: SAMSUNG DISPLAY CO LTDPriority: Aug 13, 2013Filed: Oct 18, 2018Granted: Apr 27, 2021
Est. expiryAug 13, 2033(~7 yrs left)· nominal 20-yr term from priority
Inventors:Kwang-Nyun Kim
H10K 59/124H10K 2102/311H10K 71/851H10K 59/1213H10K 59/873H10K 59/80H10K 50/844H10K 59/8722Y02P70/50Y02E10/549H10K 77/111H01L 27/3258H01L 27/3244H01L 51/0097H01L 2251/566H01L 2251/5338H01L 51/56H01L 27/3246H01L 51/5253H01L 51/524H10K 50/841H10K 59/122H10K 59/12H10K 71/00
60
PatentIndex Score
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Cited by
25
References
33
Claims

Abstract

A flexible display may suppress a generation of cracks in an inorganic layer and suppress the spread of cracks. A flexible display includes a flexible substrate and an inorganic layer formed on the flexible substrate. A display unit is formed on the inorganic layer. The display unit includes a plurality of pixels. Each pixel includes an organic light emitting diode. A thin film encapsulation layer covers the display unit. A crack suppressing layer is formed along the edge of the flexible substrate. The crack suppressing layer is disposed on the inorganic layer at an exterior side of the thin film encapsulation layer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A flexible display, comprising:
 a flexible substrate; 
 an inorganic layer disposed on the flexible substrate, wherein the inorganic layer comprises a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer; 
 a display unit disposed on the inorganic layer, wherein the display unit includes a plurality of pixels, each pixel thereof including an organic light emitting diode; 
 a thin film encapsulation layer covering the display unit; and 
 a crack suppressing layer formed along an edge of the flexible substrate, wherein the crack suppressing layer is disposed directly on the interlayer insulating layer of the inorganic layer at an exterior side of the thin film encapsulation layer, wherein the crack suppressing layer is configured to contact the edge of the flexible substrate, and the crack suppressing layer is disposed at an uppermost edge of the flexible substrate. 
 
     
     
       2. The flexible display of  claim 1 , wherein the barrier layer, the buffer layer, the gate insulating layer, and the interlayer insulating layer cover an entire top surface of the flexible substrate. 
     
     
       3. The flexible display of  claim 1 , wherein the barrier layer and the buffer layer cover an entire top surface of the flexible substrate, and the gate insulating layer and the interlayer insulating layer are disposed at an interior side of the crack suppressing layer, and the gate insulating layer and the interlayer insulating layer are disposed at a constant distance from the edge of the flexible substrate. 
     
     
       4. The flexible display of  claim 1 , wherein the barrier layer and the buffer layer cover an entire top surface of the flexible substrate, and the gate insulating layer and the interlayer insulating layer are disposed at an inner side of the crack suppressing layer at a constant distance from the edge of the flexible substrate. 
     
     
       5. The flexible display of  claim 1 , wherein the barrier layer, the buffer layer, the gate insulating layer, and the interlayer insulating layer are formed at an inner side of the crack suppressing layer between the edge of the flexible substrate and the crack suppressing layer. 
     
     
       6. The flexible display of  claim 1 , wherein the crack suppressing layer comprises an organic material. 
     
     
       7. The flexible display of  claim 6 , wherein the display unit comprises a planarization layer and a pixel defining layer, and the crack suppressing layer comprises a same material as the planarization layer or the pixel defining layer. 
     
     
       8. The flexible display of  claim 7 , wherein the crack suppressing layer comprises a first layer including a same material as the planarization layer and a second layer including a same material as the pixel defining layer. 
     
     
       9. The flexible display of  claim 6 , wherein the crack suppressing layer comprises at least one of a UV curable resin and a thermosetting resin. 
     
     
       10. A display device, comprising:
 a flexible substrate; 
 an inorganic layer disposed on a portion of the flexible substrate, wherein the inorganic layer comprises a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer, and wherein a portion of the flexible substrate is not covered by the inorganic layer; 
 a thin film encapsulation layer disposed over a display unit, wherein the display unit is disposed on the inorganic layer; and 
 a crack suppressing layer formed over the portion of the flexible substrate not covered by the inorganic layer, wherein the crack suppressing layer is disposed directly on the inorganic layer and the crack suppressing layer covers a side portion of the inorganic layer comprising the barrier layer, the buffer layer, the gate insulating layer and the interlayer insulating layer, and a top portion of the inorganic layer, wherein the crack suppressing layer is configured to prevent cracks from forming in the inorganic layer during a cutting process, wherein the crack suppressing layer is configured to contact the edge of the flexible substrate, and the crack suppressing layer is disposed at an uppermost edge of the flexible substrate. 
 
     
     
       11. The display of  claim 10 , further comprising an upper protection film disposed on the thin film encapsulation layer. 
     
     
       12. The display of  claim 10 , wherein the crack suppressing layer comprises a first layer and a second layer. 
     
     
       13. The display of  claim 10 , wherein the crack suppressing layer comprises a UV curable resin or a thermosetting resin. 
     
     
       14. The display of  claim 10 , wherein the crack suppressing layer comprises a sealant. 
     
     
       15. A flexible display, comprising:
 a flexible substrate; 
 an inorganic layer disposed on the flexible substrate, wherein the inorganic layer comprises a barrier layer, a buffer layer, a gate insulating layer, and an interlayer insulating layer; 
 a display unit disposed on the inorganic layer, wherein the display unit includes a plurality of pixels, each pixel thereof including an organic light emitting diode; 
 a thin film encapsulation layer covering the display unit; and 
 a crack suppressing layer formed along an edge of the flexible substrate, wherein the crack suppressing layer is disposed directly on the interlayer insulating layer of the inorganic layer at an exterior side of the thin film encapsulation layer, and wherein the crack suppressing layer is formed at an inner side spaced apart from the edge of the flexible substrate, and the crack suppressing layer covers a portion of the inorganic layer. 
 
     
     
       16. The flexible display of  claim 15 , wherein the barrier layer and the buffer layer cover an entire top surface of the flexible substrate, and the gate insulating layer and the interlayer insulating layer are disposed at an inner side of the crack suppressing layer at a constant distance spaced apart from the edge of the flexible substrate. 
     
     
       17. The flexible display of  claim 15 , wherein the barrier layer, the buffer layer, the gate insulating layer, and the interlayer insulating layer are formed at an inner side of the crack suppressing layer between spaced apart from the edge of the flexible substrate and the crack suppressing layer. 
     
     
       18. A flexible display, comprising:
 a flexible substrate;   a transistor disposed on the flexible substrate and including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode;   a first inorganic layer disposed between the semiconductor layer and the flexible substrate;   an organic light emitting diode disposed on the transistor and electrically connected to the transistor;   a second inorganic layer disposed on the semiconductor layer;   a third inorganic layer disposed between the first inorganic layer and the flexible substrate;   a fourth inorganic layer disposed between the second inorganic layer and the semiconductor layer;   a thin film encapsulation layer covering the organic light emitting diode; and   a crack suppressing layer disposed directly on the second inorganic layer and along an edge of the flexible substrate,   wherein at least a portion of the crack suppressing layer and at least a portion of the thin film encapsulation layer are in contact with the second inorganic layer, and the crack suppressing layer includes a first portion in contact with a lateral side of the second inorganic layer, a second portion in contact with an upper side of the second inorganic layer, and a third portion in contact with the upper side of the first inorganic layer.   
     
     
       19. The flexible display of claim 18, wherein:
 the organic light emitting diode includes a first electrode electrically connected to the transistor, an organic emission layer disposed on the first electrode, and a second electrode disposed on the organic emission layer, the flexible display further comprising:   a first organic layer disposed between the second inorganic layer and the organic light emitting diode; and   a second organic layer disposed between the first organic layer and the second electrode and including an opening that overlaps at least a portion of the first electrode, and   the crack suppressing layer comprising a same material as at least one of the first organic layer and the second organic layer.   
     
     
       20. The flexible display of claim 19, wherein:
 a height of the crack suppressing layer is smaller than a height of the thin film encapsulation layer with reference to the flexible substrate.   
     
     
       21. The flexible display of claim 20, wherein:
 the crack suppressing layer is spaced apart from the edge of the flexible substrate by a constant distance.   
     
     
       22. The flexible display of claim 18, wherein:
 the organic light emitting diode includes a first electrode electrically connected to the transistor, an organic emission layer disposed on the first electrode, and a second electrode disposed on the organic emission layer,   the flexible display further comprising:   a first organic layer disposed between the second inorganic layer and the organic light emitting diode; and   a second organic layer disposed between the first organic layer and the second electrode and including an opening that overlaps at least a portion of the first electrode, and   at least a portion of the first organic layer is in contact with the second inorganic layer.   
     
     
       23. The flexible display of claim 22, wherein:
 a height of the crack suppressing layer is smaller than a height of the thin film encapsulation layer with reference to the flexible substrate.   
     
     
       24. The flexible display of claim 23, wherein:
 the crack suppressing layer is spaced apart from the edge of the flexible substrate by a constant distance.   
     
     
       25. The flexible display of claim 18, wherein:
 a height of the crack suppressing layer is smaller than a height of the thin film encapsulation layer with reference to the flexible substrate.   
     
     
       26. The flexible display of claim 18, wherein:
 the crack suppressing layer is spaced apart from the edge of the flexible substrate by a constant distance.   
     
     
       27. The flexible display of claim 18, wherein:
 a total thickness of the first inorganic layer and the second inorganic layer decreases at the edge of the flexible substrate.   
     
     
       28. The flexible display of claim 18, wherein:
 the organic light emitting diode is disposed on the second inorganic layer; and   a total thickness of the first inorganic layer and the second inorganic layer at the edge of the flexible substrate is smaller than a total thickness of the first inorganic film and the second inorganic film in a display area of the flexible substrate where the organic light emitting diode is disposed.   
     
     
       29. The flexible display of claim 18, wherein:
 the organic light emitting diode is disposed on the second inorganic layer;   the second inorganic layer and the fourth inorganic layer extend from a display area of the flexible substrate where the organic light emitting diode is disposed to the edge of the flexible substrate, and   edges of the second inorganic layer and the fourth inorganic layer are disposed at a constant distance from the edge of the flexible substrate.   
     
     
       30. A flexible display, comprising:
 a flexible substrate;   a transistor disposed on the flexible substrate and including a semiconductor layer, a gate electrode, a source electrode and a drain electrode;   a first inorganic layer disposed between the semiconductor layer and the flexible substrate;   an organic light emitting diode including a first electrode electrically connected to the transistor, an organic emission layer disposed on the first electrode, and a second electrode disposed on the organic emission layer;   a second inorganic layer disposed on the semiconductor layer;   a first organic layer disposed between the second inorganic layer and the organic light emitting diode;   a second organic layer disposed between the first organic layer and the second electrode and including an opening that overlaps at least a portion of the first electrode;   a third inorganic layer disposed between the first inorganic layer and the flexible substrate;   a fourth inorganic layer disposed between the second inorganic layer and the semiconductor layer;   a thin film encapsulation layer covering the organic light emitting diode; and   a crack suppressing layer disposed directly on the second inorganic layer and along an edge of the flexible substrate,   wherein at least a portion of the first organic layer is in contact with the second inorganic layer, and   the crack suppressing layer includes a first portion in contact with a lateral side of the second inorganic layer, a second portion in contact with a upper side of the second inorganic layer, and a third portion in contact with the upper side of the first inorganic layer.   
     
     
       31. The flexible display of claim 30, wherein:
 a height of the crack suppressing layer is smaller than a height of the thin film encapsulation layer with reference to the flexible substrate.   
     
     
       32. The flexible display of claim 30, wherein:
 the crack suppressing layer is spaced apart from the edge of the flexible substrate by a constant distance.   
     
     
       33. The flexible display of claim 30, wherein:
 the second inorganic layer and the fourth inorganic layer extend from a display area of the flexible substrate where the organic light emitting diode is disposed to the edge of the flexible substrate, and   edges of the second inorganic layer and the fourth inorganic layer are disposed at a constant distance from the edge of the flexible substrate.

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