USRE43957EActiveUtility

High-frequency module including connection terminals arranged at a small pitch

Assignee: MURATA MANUFACTURING COPriority: Aug 21, 2006Filed: Jun 10, 2011Granted: Feb 5, 2013
Est. expiryAug 21, 2026(~0.1 yrs left)· nominal 20-yr term from priority
Inventors:Taturo Nagai
H10W 70/63H03H 9/0576Y02P70/50H05K 1/113H05K 2201/10636H05K 2201/10522H01P 1/047H05K 1/0243H03H 9/0542H03H 9/72H05K 1/114H05K 1/181H05K 2201/1006H05K 1/117H03H 9/725
48
PatentIndex Score
1
Cited by
19
References
3
Claims

Abstract

In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface, and mounting lands arranged to mount at least one element electrically connected to the filter device are arranged at the opposite side. At least two of a plurality of connection terminals provided on a substrate bottom surface are respectively connected to conductor patterns connected to via-hole conductors penetrating the substrate within a mounting area for mounting the filter device via connection lines and are arranged at a pitch which is less than the pitch of the via-hole conductors.

Claims

exact text as granted — not AI-modified
1. A high-frequency module comprising:
 a substrate having including a first main surface and a second main surface, and including a plurality of connection terminals arranged to be connected to another circuit and provided on the first main surface of the substrate, and a plurality of mounting lands provided on the second main surface; 
 at least one filter device mounted at a first side of the second main surface of the substrate, the at least one filter device including at least one set of an unbalanced terminal and two balanced terminals; and 
 at least one element mounted at a second side opposite to the first side of the second main surface of the substrate, the at least one element being electrically connected to the at least one filter device; wherein 
 the plurality of mounting lands includes at least two balanced mounting lands connected to the balanced terminals of the at least one filter device and at least two element mounting lands connected to the at least one element; 
 at least two connection wires are provided on the second main surface of the substrate, respectively connecting the at least two balanced mounting lands and the at least two element mounting lands; 
 at least two connection lines are provided on the first main surface; 
 via-hole conductors are provided in a mounting area of the substrate to mount the at least one filter device so as to penetrate the substrate from the second main surface to the first main surface; 
 at least two of the plurality of connection terminals define specific connection terminalsand, which are arranged on the first main surface of the substrate at the second side, so as to be spaced from the via-hole conductorspenetrating the substrate from inside a mounting area for mounting the at least one filter device on the second main surface of the substrate to the first main surface of the substrate, and which are connected to first ends of the at least two connection lines; 
 at least two connection lines respectively electrically connecting the specific connection terminals and the via-hole conductors are provided on the first main surface of the substrate; andfirst ends of the via-hole conductors are respectively connected to the at least two balanced mounting lands, and second ends of the via-hole conductors are respectively connected to second ends of the at least two connection lines; and 
 a pitch of the specific connection terminals connected to the first ends of the at least two connection lines is less than a pitch of the via-hole conductors respectively electrically the at least two element mounting lands connected to the specific connection terminals via the at least two connection wires, the at least two balanced mounting lands, the via-hole conductors, and the at least two connection lines. 
 
     
     
       2. The high-frequency module according to  claim 1 , wherein the at least one filter device includes at least two sets of the unbalanced terminal and the two balanced terminals and at least two sets of filters corresponding to at least two bands, and the two balanced terminals are arranged on the second main surface of the substrate, so as to be adjacent to the at least one element. 
     
     
       3. The high-frequency module according to  claim 1 , wherein the at least one element is an inductor connected in parallel across at least one set of the two balanced terminals of the at least one filter device.

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