Semiconductor package with heat dissipating structure

Abstract

A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a substrate. The support portions are mounted at predetermined area on the substrate without interfering with arrangement of the chip and bonding wires that electrically connect the chip to the substrate. The support portions are arranged to form a space embraced by adjacent supports and the flat portion, so as to allow the bonding wires to pass through the space to reach area on the substrate outside coverage of the heat dissipating structure; besides, passive components or other electronic components can be mounted on the substrate at area within or outside the coverage of the heat dissipating structure, thereby improving flexibility in component arrangement in the semiconductor package.

1. A heat dissipating structure for a semiconductor package having a substrate, at least a chip mounted on the substrate and electrically connected to the substrate via a plurality of conductive elements, and one or more passive components mounted on the substrate, the heat dissipating structure comprising:
 a flat portion, wherein at least a peripherally-situated recess is formed on a top surface of the flat portion; and 
 a plurality of support portions formed at edge corners of the flat portion and outmost corners of the heat dissipating structure for supporting the flat portion in position above the chip, each of the support portions further comprising at least two panels and a contact portion formed between the panels at a respective outmost corner of the heat dissipating structure, wherein the support portions are mounted at a predetermined area on the substrate and free of interference with an arrangement of the chip, the passive components and the conductive elements, and the support portions are arranged to form a space between two adjacent support portions, the space being sufficiently dimensioned to accommodate the conductive elements and the passive components so as to allow the conductive elements to pass through the space to reach an area on the substrate outside coverage of the heat dissipating structure and such that the passive components are located within and/or outside the coverage of the heat dissipating structure. 
 
     
     
       2. The heat dissipating structure of  claim 1 , wherein the conductive elements are bonding wires, and a plurality of bond fingers are formed on the substrate for allowing the bonding wires to be bonded to the bond fingers. 
     
     
       3. The heat dissipating structure of  claim 2 , wherein the flat portion is elevated above the chip by the support portions and forms a predetermined height difference with respect to the substrate, allowing the height difference to be larger than a height of wire loops of the bonding wires. 
     
     
       4. The heat dissipating structure of  claim 3 , wherein part of the bond fingers are situated on the substrate at an area outside the coverage of the heat dissipating structure, allowing the corresponding bonding wires to pass through the space embraced by adjacent support portions and the flat portion and to reach the outside-coverage bond fingers. 
     
     
       5. The heat dissipating structure of  claim 1 , wherein the support portions are situated at edge corners of the flat portion. 
     
     
       6. The heat dissipating structure of  claim 1 , wherein the chip and the conductive elements are encapsulated by an encapsulant formed on the substrate. 
     
     
       7. The heat dissipating structure of  claim 6 , wherein the flat portion has a top surface exposed to outside of the encapsulant, and a bottom surface opposed to the top surface, the bottom surface being formed with the support portions. 
     
     
       8. The heat dissipating structure of  claim 7 , wherein at least a protrusion is formed on the bottom surface of the flat portion and extends toward the chip. 
     
     
       9. The heat dissipating structure of  claim 1 , wherein each of the support portions is formed with at least a hole for allowing an encapsulating resin used for forming the encapsulant to pass through the hole. 
     
     
       10. The heat dissipating structure of  claim 1 , wherein each of the support portions is formed with a contact portion at a position in contact with the substrate. 
     
     
       11. The heat dissipating structure of  claim 10 , wherein the contact portion substantially extends laterally with respect to the substrate. 
     
     
       12. The heat dissipating structure of  claim 10 , wherein the contact portion is of a triangular, rectangular or semicircular shape. 
     
     
       13. A heat dissipating structure for a semiconductor package having a plurality of conductive elements and one or more passive components, comprising:
 a flat portion having a top surface and a bottom surface opposed to the top surface, wherein at least a peripherally-situated recess is formed on the top surface of the flat portion; and 
 a plurality of support portions formed at edge corners of the bottom surface of the flat portion and outmost corners of the heat dissipating structure, each of the support portions further comprising at least two panels and a contact portion formed between the panels at a respective outmost corner of the heat dissipating structure, wherein the support portions are arranged to form a space between two adjacent support portions, and the space is sufficiently dimensioned to accommodate the conductive elements and the passive components. 
 
     
     
       14. The heat dissipating structure of  claim 13 , wherein the conductive elements are bonding wires, such that the space is dimensioned to have a predetermined height larger than a height of wire loops of the bonding wires. 
     
     
       15. The heat dissipating structure of  claim 13 , wherein at least a protrusion is formed on the bottom surface of the flat portion. 
     
     
       16. The heat dissipating structure of  claim 13 , wherein the top surface of the flat portion is exposed to outside of the semiconductor package. 
     
     
       17. The heat dissipating structure of  claim 13 , wherein each of the support portions is formed with at least a hole for allowing an encapsulating resin used in the semiconductor package to pass through the hole. 
     
     
       18. The heat dissipating structure of  claim 13 , wherein each of the support portions has one end attached to the flat portion and the other end formed with a contact portion. 
     
     
       19. The heat dissipating structure of  claim 18 , wherein the contact portion substantially extends laterally with respect to the flat portion. 
     
     
       20. The heat dissipating structure of  claim 18 , wherein the contact portion is of a triangular, rectangular or semicircular shape. 
     
     
       21. A heat dissipating structure for a semiconductor package having a plurality of bonding wires and one or more passive components, comprising:
 a flat portion having a top surface and a bottom surface opposed to the top surface, wherein at least a peripherally-situated recess is formed on the top surface of the flat portion; and 
 a plurality of support portions formed at edge corners of the bottom surface of the flat portion and outmost corners of the heat dissipating structure, each of the support portions further comprising at least two panels and a contact portion formed between the panels at a respective outmost corner of the heat dissipating structure, wherein the support portions are arranged to form a space between two adjacent support portions, and the space is dimensioned to have a predetermined height larger than a height of wire loops of the bonding wires and a height of the passive components. 
 
     
     
       22. The heat dissipating structure of  claim 21 , wherein at least a protrusion is formed on the bottom surface of the flat portion. 
     
     
       23. The heat dissipating structure of  claim 21 , wherein the top surface of the flat portion is exposed to outside of the semiconductor package. 
     
     
       24. The heat dissipating structure of  claim 21 , wherein each of the support portions is formed with at least a hole for allowing an encapsulating resin used in the semiconductor package to pass through the hole. 
     
     
       25. The heat dissipating structure of  claim 21 , wherein each of the support portions has one end attached to the flat portion and the other end formed with a contact portion. 
     
     
       26. The heat dissipating structure of  claim 24 , wherein the contact portion substantially extends laterally with respect to the flat portion. 
     
     
       27. The heat dissipating structure of  claim 24 , wherein the contact portion is of a triangular, rectangular or semicircular shape. 
     
     
       28. A heat dissipating structure for a semiconductor package having a plurality of bonding wires, comprising:
 a flat portion having a top surface and a bottom surface opposed to the top surface, wherein at least a peripherally-situated recess is formed on the top surface of the flat portion; and   a plurality of support portions formed at edge corners of the bottom surface of the flat portion and outmost corners of the heat dissipating structure, each of the support portions further comprising:
 a connecting portion including at least two panels; and 
 a contact portion formed between the panels at a respective outmost corner of the heat dissipating structure, the contact portion being connected to the flat portion via the connecting portion, 
   wherein the support portions are arranged to form a space between two adjacent support portions, and the space is dimensioned to have a predetermined height larger than a height of wire loops of the bonding wires.   
     
     
       29. The heat dissipating structure of claim 28, wherein the connecting portion has a first end attached to the flat portion and a second end connected with the contact portion. 
     
     
       30. The heat dissipating structure of claim 28, wherein the contact portion substantially extends laterally with respect to the flat portion. 
     
     
       31. The heat dissipating structure of claim 28, wherein the space between the two adjacent support portions is configured to accommodate one or more passive components, such that the one or more passive components are located within a coverage of the heat dissipating structure. 
     
     
       32. The heat dissipating structure of claim 28, wherein the space between the two adjacent support portions is configured to accommodate one or more passive components, such that the one or more passive components are located outside a coverage of the heat dissipating structure.