Wiring board construction and methods of making same

Abstract

A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.

What is claimed is:  
     
       1. A wiring board construction, comprising: 
       a base substrate; and  
       means defining at least one microvia being disposed in a top surface of said substrate and including a deep imprinted rounded cup shaped recess in the top surface thereof, said recess extending partially through said substrate, a conductor material being disposed within the recess, said material having a portion being disposed at a bottom portion of the recess, and a conductor disposed at a bottom surface of said substrate opposite to said conductor material disposed at the bottom portion of the recess; and said substrate having a thin readily penetrable rounded web defining the bottom portion of the recess to facilitate interconnecting electrically said conductor material and said conductor to complete an electrically conductive path through said substrate, said conductor material and said conductor having portions thereof extending through a bottom portion of said web to complete electrical contact between said conductor material and said conductor.  
     
     
       2. A wiring board construction according to  claim 1 , wherein said substrate is composed of an epoxy composition. 
     
     
       3. A wiring board construction according to  claim 2 , wherein said epoxy composition is “HYSOL.” 
     
     
       4. A wiring board construction including at least one Microvis microvia therein made by a process comprising: 
       using a compressible substrate;  
       using a deep rounded cup shaped recess in a top surface of the substrate, the recess extending partially through the substrate and leaving a thin readily penetrable rounded web of substrate material at a bottom portion of the recess;  
       adding a cup shaped conductor material on at least a portion of the recess of the top surface, said conductor material including a portion being disposed at the bottom portion of the recess;  
       disposing a conductor at a bottom surface of said substrate opposite said conductor material disposed at the bottom portion of the recess to complete an electrically conductive path through said substrate to form a Microvis microvia in said substrate; and  
       extending at least one of said conductor material and said conductor through a bottom portion of said web to complete electrical contact between said conductor material and said conductor.  
     
     
       5. A wiring board construction according to  claim 4 , wherein said conductor material includes electroplating. 
     
     
       6. A wiring board construction according to  claim 4 , wherein said conductor material includes transferring metal. 
     
     
       7. A multiple layer wiring board construction, comprising: 
       a top substrate;  
       a deep imprinted rounded cup-shaped recess in a top surface of said top substrate, the recess extending partially through the top substrate;  
       a thin readily penetrable web of substrate material defining a bottom portion of the recess;  
       conductor material disposed within the recess, said material having a portion being disposed at the bottom portion of the recess; and  
       a bottom substrate underlying a bottom surface of said top substrate and having an imprinted cup shaped recess therein and a cup-shaped conductor disposed therein near a top surface of said bottom substrate thereof opposite to the conductor material disposed at the bottom portion of the top substrate recess to complete an electrically conductive path through the top substrate; and  
       wherein at least one of said conductor material and of said conductor have portions thereof extending through a bottom portion of said web to complete electrical contact between said conductor material and said conductor, thereby forcing forming a Microvis microvia through said substrates.  
     
     
       8. A multiple layer wiring board construction according to  claim 7 , wherein said conductor material and cup shaped conductor are electroplated. 
     
     
       9. A multiple layer wiring board construction according to  claim 7 , wherein said top and bottom substrates are each composed of thermoset material. 
     
     
       10. A method of making a multiple layer wiring board, comprising: 
       using a top substrate;  
       imprinting a deep rounded cup shaped recess in a top surface of said top substrate and extending partially through the top substrate to leave a thin readily penetrable web of substrate material at a bottom portion of the recess;  
       adding a cup shaped conductor material on a surface of said recess, said material having a portion being disposed at the bottom portion of the recess;  
       using a bottom substrate having a conductor disposed at a top surface thereof; and  
       disposing the bottom substrate in underlying relationship with a bottom surface of said top substrate, the conductor disposed at the top surface of the bottom substrate being positioned opposite to the conductor material disposed at the bottom of the recess to complete an electrically conductive path through said top substrate, thereby forming a Microvis microvia through said and bottom top substrate; and  
       extending at least one of said conductor material and said conductor through a bottom portion of said web to complete electrical contact between said conductor material and said conductor.  
     
     
       11. A method according to  claim 10 , further including forming a deep imprinted cup shaped recess in the top surface of said bottom substrate; 
       disposing the bottom substrate conductor within the recess in said bottom substrate.  
     
     
       12. A method of making a multiple layer wiring board according to  claim 11 , further using a third substrate having a conductor, disposing the conductor of said third substrate in electrical contact with the conductor of the bottom substrate, thereby forming a Microvis microvia through said top and bottom substrates. 
     
     
       13. A method of making a multiple layer wiring board, according to  claim 12 , wherein said substrates are each composed of thermoset material. 
     
     
       14. A wiring board construction, comprising: 
       an imprintable substrate;  
       means defining a shallow groove in a top surface of said substrate;  
       a conductor disposed within said groove;  
       means defining a Microvis microvia being disposed substantially within said groove and connected electrically to its a pad, and including a deep imprinted rounded cup shaped recess disposed entirely within said groove, the recess extending partially through the substrate;  
       a thin readily penetrable web composed of substrate material defining a bottom portion of the recess;  
       imprinted conductor material lining at least a portion of said recess, said material being disposed at the bottom of the recess portion; and  
       a conductor disposed at a bottom surface of said substrate opposite to said conductor material disposed at the bottom of the recess bottom portion to complete an electrically conductive path through said substrate; and  
       wherein at least one of said conductor material and said conductor have portions thereof extending through the bottom portion of said web to complete electrical contact between said conductor material and said conductor.  
     
     
       15. A wiring board construction according to  claim 14 , wherein said substrate is composed of an epoxy material. 
     
     
       16. A wiring board construction according to  claim 15 , wherein said epoxy material is thermoset material. 
     
     
       17. A wiring board construction according to  claim 14 , wherein said substrate includes a material selected from the material group consisting of resins, polymers, thermosets, thermoplastics, psyclosets, psycloplastics, green body technology and ceramics. 
     
     
       18. A method of making a wiring board construction, comprising: 
       forming a shallow groove in a top surface of a substrate;  
       disposing a conductor within said groove;  
       imprinting a deep rounded cup-shaped recess within said groove and extending partially through the substrate to leave a thin readily penetrable web of substrate material at a bottom portion of the recess;  
       lining at least a portion of said recess with conductor material, said material being disposed at the bottom portion of the recess; and  
       disposing a conductor at a bottom surface of said substrate opposite to said conductor material disposed at the bottom portion of the recess to help complete an electrically conductive path through said substrate; and  
       extending at least one of said conductor material and said conductor through a bottom portion of said web to complete electrical contact between said conductor material and said conductor.  
     
     
       19. A standard grid array construction, comprising: 
       a first substrate;  
       a conductor pad disposed at a bottom surface of said first substrate;  
       a second substrate underlying said first substrate;  
       means defining a Microvis recess being disposed substantially within said second substrate, the Microvis recess further including an imprinted rounded cup-shaped a recess with a conductor lining, a thin readily penetrable web composed of second substrate material defining a bottom portion of the recess; and  
       a third substrate underlying said second substrate, said third substrate having a conductor connected electrically to the Microvis recess within said first and second substrates and to the conductor pad of the first substrate.  
     
     
       20. A ball grid array, comprising: 
       a substrate;  
       a top shallow rounded cup shaped recess in a an upper surface of said substrate;  
       a conductor lining said shallow rounded cup shaped top recess;  
       a bottom deep rounded cup-shaped recess in a bottom surface of said substrate axially aligned with said top shallow rounded cup shaped recess; and  
       conductive means of filling said deep bottom recess; and  
       a thin shallow readily penetrable rounded cup-shaped web composed of substrate material separating said shallow rounded cup-shaped top recess from said deep bottom recess.  
     
     
       21. A ball grid array according to  claim 20 , wherein said conductive means is conductive microvia fill material. 
     
     
       22. An interconnect carrier sheet, comprising: 
       a base substrate;  
       a top deep rounded cup-shaped imprinted recess, in a top surface of said substrate;  
       a bottom deep rounded cup-shaped imprinted recess axially aligned with a said top recess in a bottom surface of said substrate;  
       a thin shallow readily penetrable web composed of substrate material separating said top recess from said bottom recess; and  
       an interconnect device disposed within the recesses and penetrating said web composed of substrate material.  
     
     
       23. A method of making an interconnect carrier sheet for receiving and supporting a group of interconnect devices, comprising: 
       using a base substrate;  
       imprinting a top deep rounded cup-shaped recess in a top surface of the said substrate;  
       imprinting a bottom deep rounded cup-shaped recess in the bottom surface of said substrate; and  
       inserting an interconnect device within the top and bottom recesses; and  
       wherein the top recess and the bottom recess are separated by a thin readily penetrable web composed of substrate material after imprinting .  
     
     
       24. A method according to  claim 23 , wherein said interconnect device is a pin, said pin being inserted to penetrate the web interposed between the top and bottom recesses. 
     
     
       25. A wiring board construction, comprising: 
       
         a base substrate having a top surface and a bottom surface;  
       
       
         a recess formed on said top surface of said base substrate, said recess having a bottom portion; and  
       
       
         a readily penetrable web of base substrate material being formed between said bottom portion of said recess and said bottom surface of said base substrate. 
       
     
     
       26. The wiring board construction according to  claim 25 , wherein said web comprises a penetrated portion adapted to allow communication between said bottom portion of said recess and said bottom surface of said base substrate. 
     
     
       27. The wiring board construction according to  claim 25 , further comprising a conductor material disposed on a surface of said recess. 
     
     
       28. The wiring board construction according to  claim 27 , further comprising a conductor disposed on said bottom surface of said base substrate. 
     
     
       29. The wiring board construction according to  claim 28 , wherein said web comprises a penetrated portion, said penetrated portion comprising an electrical connection between said conductor material and said conductor. 
     
     
       30. The wiring board construction according to  claim 25 , further comprising a conductor disposed on said bottom surface of said base substrate. 
     
     
       31. The wiring board construction according to  claim 25 , wherein said web is electrically penetrable. 
     
     
       32. A wiring board construction according to  claim 25 , wherein said substrate is composed of an epoxy composition. 
     
     
       33. A wiring board construction according to  claim 32 , wherein said epoxy composition is “HYSOL.” 
     
     
       34. A wiring board construction including at least one microvia therein made by a process comprising: 
       
         forming a recess in a top surface of a compressible substrate, the recess extending partially through the substrate and leaving a readily penetrable web of substrate material between a bottom portion of the recess and a bottom surface of the substrate;  
       
       
         disposing a conductor material on at least a portion of the recess, said portion including the bottom portion of the recess; and  
       
       
         disposing a conductor on the bottom surface of said substrate in an aligned configuration with the bottom portion of the recess. 
       
     
     
       35. The wiring board construction according to  claim 34 , further comprising: 
       
         extending at least one of said conductor material and said conductor through said web to complete a conductive path between said conductor material and said conductor. 
       
     
     
       36. A wiring board construction according to  claim 34 , wherein said disposing a conductor material includes electroplating. 
     
     
       37. A wiring board construction according to  claim 34 , wherein said disposing a conductor material includes transferring metal. 
     
     
       38. A multiple layer wiring board construction, comprising: 
       
         a top substrate having a top surface and a bottom surface, said top surface having a first recess formed thereon, said first recess extending partially through said top substrate;  
       
       
         a readily penetrable web of substrate material formed between a bottom portion of said first recess and said bottom surface of said top substrate;  
       
       
         a conductor material disposed at least upon said bottom portion of said first recess; and  
       
       
         a bottom substrate underlying a bottom surface of said top substrate and having a second recess formed thereon and a conductor disposed substantially on a top surface of said bottom substrate, said conductor being aligned with said bottom portion of said first recess. 
       
     
     
       39. The multiple layer wiring board construction according to  claim 38 , wherein at least one of said conductor material and said conductor have portions thereof extending through said web to complete a conductive path between said conductor material and said conductor, thereby forming a microvia through said top substrate. 
     
     
       40. A multiple layer wiring board construction according to  claim 38 , wherein said conductor material and said conductor are electroplated. 
     
     
       41. A multiple layer wiring board construction according to  claim 38 , wherein said top and bottom substrates are each composed of thermoset material. 
     
     
       42. A method of making a multiple layer wiring board, comprising: 
       
         imprinting a recess in a top surface of a top substrate, said recess extending partially through the top substrate to leave a readily penetrable web of substrate material at a bottom portion of the first recess;  
       
       
         adding a conductor material on at least said bottom portion of said recess;  
       
       
         disposing a bottom substrate in underlying relationship with a bottom surface of said top substrate, said bottom substrate having a conductor disposed on a top surface thereof, the conductor being aligned with said bottom portion of the recess. 
       
     
     
       43. The method according to  claim 42 , further comprising: 
       
         extending at least one of said conductor material and said conductor through said web to complete a conductive path between said conductor material and said conductor. 
       
     
     
       44. A method according to  claim 42 , further comprising: 
       
         forming a recess in the top surface of said bottom substrate;  
       
       
         disposing the conductor within the recess in said bottom substrate. 
       
     
     
       45. A method of making a multiple layer wiring board according to  claim 42 , further comprising: 
       
         disposing a third substrate having a conductor, the conductor of said third substrate being in electrical contact with the conductor of the bottom substrate, thereby forming a microvia through said top and bottom substrates.