Method of fabricating a liquid crystal display

Abstract

A light influencing element and the process of fabricating the same is disclosed, wherein the light influencing element is fabricated by disposing a layer of a substantially opaque material upon a transparent substrate. One or more openings or wells may then be cut or formed in the surface of the layer of opaque material. Into such openings a light influencing material is then disposed, preferable said materials are injected thereinto as by ink-jet type injection heads. Liquid crystal displays and subassemblies formed upon the light influencing elements of the instant invention are also provided.

I claim:  
     
       1. A method of fabricating a liquid crystal display subassembly, said method comprising the steps of: 
       providing a substantially transparent substrate member;  
       disposing a layer of substantially opaque material upon one side of said substrate, said substantially opaque material being a black polyimide material;  
       forming at least one opening through said layer of substantially opaque material;  
       disposing a light influencing material in said at least one opening;  
       disposing a continuous layer of a transparent, passivating material atop said layer of opaque material and said light influencing material; and  
       disposing a layer of transparent, conductive material atop said passivating layer.  
     
     
       2. A method as in  claim 1 , wherein the step of providing a substantially transparent substrate member includes the further step of selecting said member from the group of materials consisting of glass, plastic, and combinations thereof. 
     
     
       3. A method as in  claim 1 , wherein the step of disposing a layer of substantially opaque material upon said substrate includes the further step of disposing said material to a thickness of between 0.10 and 100.0 μm. 
     
     
       4. A method as in  claim 3 , wherein the opaque material is disposed to a thickness of between 1.0 and 10.0 μm. 
     
     
       5. A method as in  claim 1 , wherein the step of forming at least one opening through said layer of substantially opaque material is accomplished by employing a method selected from the group of a high power laser, a photolithographic etch process, and combinations thereof. 
     
     
       6. A method as in  claim 5 , wherein the step of forming at least one opening includes the further steps of: 
       providing a high power excimer laser capable of at least micron scale resolution;  
       placing said substrate with said layer of opaque material in close proximity to said laser;  
       providing means for achieving relative movement between said laser and said substrate; and  
       employing said laser to cut at least one opening in said layer of opaque material.  
     
     
       7. A method as in  claim 1 , wherein the step of forming at least one opening includes the further step of forming a plurality of similarly sized and shaped openings, arranged in a densely packed, uniformly spaced array. 
     
     
       8. A method as in  claim 1 , wherein the step of disposing a light influencing material into said at least one opening includes the further steps of: 
       providing a light influencing material in a non-solid phase having the optical characteristics thereof optimized for a desired application; injecting a sufficient amount of said light influencing material into said openings so as to achieve a desired light influencing effect; and  
       curing said non-solid light influencing material to the solid phase.  
     
     
       9. A method as in  claim 8 , wherein the step of injecting light influencing material into said openings includes the further steps of: 
       providing at least one nozzle for injecting said materials, in close proximity to one of said openings;  
       providing means for achieving relative movement between said nozzle and said opaque material coated substrate, for disposing light influencing material into preselected ones of said openings.  
     
     
       10. A method as in  claim 9 , wherein the step of curing said light influencing material includes the further steps of: 
       providing infrared oven means; and  
       disposing said substrate, layer of opaque material, and light influencing material into said oven means so as to solidify said light influencing material.  
     
     
       11. A method as in  claim 1 , including the further step of selecting a light influencing material adapted to color white light. 
     
     
       12. A method as in  claim 11 , wherein said light influencing material is adapted to color light into the group of colors consisting of red, green, blue, and combinations thereof. 
     
     
       13. A method of fabricating a liquid crystal display, said method comprising the steps of: 
       providing a substantially transparent first substrate member;  
       disposing a layer of substantially opaque material upon one side of said first substrate;  
       forming at least one opening through said layer of substantially opaque material;  
       disposing a light influencing material in said at least one opening;  
       disposing a continuous layer of a transparent, passivating material atop said layer of opaque material and said light influencing material;  
       disposing a layer of transparent, conductive material atop said passivating layer;  
       providing a second substantially transparent substrate member having a continuous layer of a transparent conductive material disposed on one surface thereof, said second substrate being spacedly disposed from said first substrate and arranged so that the layer of transparent conductive material of the second substrate faces the layer of transparent conductive material of the first substrate; and  
       disposing a layer of liquid crystal material between said first and said second substrates.  
     
     
       14. A method of fabricating a liquid crystal display, said method comprising the steps of: 
       
         providing a substantially transparent first substrate member;  
       
       
         disposing a layer of substantially opaque material upon one side of said first substrate;  
       
       
         forming at least three openings through said layer of substantially opaque material;  
       
         injecting a light influencing material as a non - solid state including first, second, and third colors in said at least three openings directly on the first substrate;    
       
         curing said injected material to a solid state;  
       
       
         disposing a continuous layer of a transparent, passivating material atop said layer of opaque material and said light influencing material;  
       
       
         disposing a layer of transparent, conductive material atop said passivating layer;  
       
       
         providing a second substantially transparent substrate member having a layer of a transparent conductive material disposed on one surface thereof, said second substrate being spacedly disposed from said first substrate and arranged so that the layer of transparent conductive material of the second substrate faces the layer of transparent conductive material of the first substrate; and  
       
       
         disposing a layer of liquid crystal material between said first and second substrates. 
       
     
     
       15. A method as in  claim 14 , wherein said light influencing material is one of a dye, ink or a pigment. 
     
     
       16. A method as in  claim 14 , wherein said plurality of openings are arranged in rows and columns. 
     
     
       17. A method as in  claim 14 , wherein said plurality of openings are arranged in a series of interlocking triangles. 
     
     
       18. A method of fabricating a liquid crystal display, said method comprising the steps of: 
       
         providing a substantially transparent first substrate member;  
       
       
         disposing a layer of substantially opaque material upon one side of said first substrate;  
       
       
         forming a plurality of openings including at least three openings through said layer of substantially opaque material;  
       
       
         injecting a light influencing material including first, second, and third colors in said at least three openings directly on the first substrate;  
       
       
         repeating said injecting process until all of the plurality of openings have been filled;  
       
       
         disposing a continuous layer of a transparent, passivating material atop said layer of opaque material and said light influencing material;  
       
       
         disposing a layer of transparent, conductive material atop said passivating layer;  
       
       
         providing a second substantially transparent substrate member having a layer of a transparent conductive material disposed on one surface thereof, said second substrate being spacedly disposed from said first substrate and arranged so that the layer of transparent conductive material of the second substrate faces the layer of transparent conductive material of the first substrate; and  
       
       
         disposing a layer of liquid crystal material between said first and second substrates. 
       
     
     
       19. A method as in  claim 18 , wherein said light influencing material is selected one of dye, ink or pigments. 
     
     
       20. A method as in  claim 18 , wherein said plurality of openings are arranged in rows and columns. 
     
     
       21. A method as in  claim 18 , wherein said plurality of openings are arranged in a series of interlocking triangles. 
     
     
       22. A method of fabricating a liquid crystal display, said method comprising the steps of: 
       
         providing a substantially transparent first substrate member;  
       
       
         disposing a layer of substantially opaque material upon one side of said first substrate;  
       
       
         forming at least one opening through said layer of substantially opaque material;  
       
       
         disposing a light influencing material in said at least one opening;  
       
       
         disposing a continuous layer of a transparent, passivating material atop said layer of opaque material and said light influencing material;  
       
       
         disposing a layer of transparent, conductive material atop said passivating layer;  
       
       
         providing a second substantially transparent substrate member having a continuous layer of a transparent conductive material disposed on one surface thereof, said second substrate being spacedly disposed from said first substrate and arranged so that the layer of transparent conductive material of the second substrate faces the layer of transparent conductive material of the first substrate;  
       
       
         patterning the continuous layer of transparent conductive material; and  
       
       
         disposing a layer of liquid crystal material between said first and said second substrates. 
       
     
     
       23. A method as in  claim 22 , wherein the step of providing a substantially transparent substrate member includes the further step of selecting said member from the group of materials consisting of glass, plastic, and combinations thereof. 
     
     
       24. A method as in  claim 22 , wherein the step of disposing a layer of substantially opaque material upon said substrate includes the further step of disposing said material to a thickness of between  0 . 10  and  100 . 0  μm. 
     
     
       25. A method as in  claim 24 , wherein the opaque material is disposed to a thickness of between  1 . 0  and  10 . 0  μm. 
     
     
       26. A method as in  claim 22 , wherein the step of forming at least one opening through said layer of substantially opaque material is accomplished by employing a method selected from the group of a high power laser, a photolithographic etch process, and combinations thereof. 
     
     
       27. A method as in  claim 26 , wherein the step of forming at least one opening includes the further steps of:  
       providing a high power excimer laser capable of at least micron scale resolution;  
       placing said substrate with said layer of opaque material in close proximity to said laser;  
       providing means for achieving relative movement between said laser and said substrate; and  
       employing said laser to cut at least one opening in said layer of opaque material. 
     
     
       28. A method as in  claim 22 , wherein the step of forming at least one opening includes the further step of forming a plurality of similarly sized and shaped openings, arranged in a densely packed, uniformly spaced array. 
     
     
       29. A method as in  claim 22 , wherein the step of disposing a light influencing material into said at least one opening includes the further steps of: 
         providing a light influencing material in a non - solid phase having the optical characteristics thereof optimized for a desired application; injecting a sufficient amount of said light influencing material into said openings so as to achieve a desired light influencing effect; and    
         curing said non - solid light influencing material to the solid phase.   
     
     
       30. A method as in  claim 29 , wherein the step of injecting light influencing material into said openings includes the further steps of: 
       
         providing at least one nozzle for injecting said materials, in close proximity to one of said openings;  
       
       
         providing means for achieving relative movement between said nozzle and said opaque material coated substrate, for disposing light influencing material into preselected ones of said openings. 
       
     
     
       31. A method as in  claim 30 , wherein the step of curing said light influencing material includes the further steps of: 
       
         providing infrared oven means; and  
       
       
         disposing said substrate, layer of opaque material, and light influencing material into said oven means so as to solidify said light influencing material. 
       
     
     
       32. A method as in  claim 22 , including the further step of selecting a light influencing material adapted to color white light. 
     
     
       33. A method as in  claim 32 , wherein said light influencing material is adapted to color light into the group of colors consisting of red, green, blue, and combinations thereof.