Flip up side stencil to be used with single site stencil printer

Abstract

Stencils to be used with a solder paste stencil printing process and apparatus in which the stencil plate having a porous figure printing area may be used for single component solder paste application. The printing operation is performed by alignment of the stencil pattern figure over the appropriate component and substrate pads. The stencil holder assembly is attached to the related solder paste stencil printer and held in place by downward force. Solder paste is dispensed over the stencil plate pattern allowing gravity flow of the paste material into the stencil pattern pores. Excess paste material is squeegeed level to the top surface of the stencil plate and the plate lifted from the substrate surface leaving solder paste in the configured pattern.

What is claimed is: 
     
       1. A solder paste stencil holder having a center portion, there being three sides extending from the center portion, with etches along the lines where said side join said center portion, a mounting block, and a shaft comprising: said center portion comprises a stencil plate, said sides being folded up along the etches;   said mounting block being attached to the stencil plate via said folded-up sides; and   said shaft being affixed to the mounting block.   
     
     
       2. A solder paste stencil holder according to claim 1, wherein said stencil holder further comprises: said stencil plate having a plurality of apertures conforming to a footprint pattern; and   said sides being of varying height as to allow the mounting block to be placed in various positions. .Iadd.   
     
     
       3.  A solder paste stencil holder having a center portion, there being three sides extending from the center portion, a mounting block, and a shaft comprising: a) said center portion comprises a stencil plate, two of said sides being folded up;   b) said mounting block being attached to the stencil plate via said folded-up sides; and,   c) said shaft being affixed to the mounting block..Iaddend..Iadd.   
     
     
       4.  The solder paste stencil holder of claim 3 further including an etch line along the line where at least one of said sides join said center portion..Iaddend.