Process to manufacture crown stacked capacitor structures with HSG-rugged polysilicon on all sides of the storage node

Abstract

The present invention develops a container capacitor by forming a first insulative layer over conductive word lines; forming an opening between neighboring conductive word lines; forming a conductive plug between neighboring parallel conductive word lines; forming a planarized blanketing second insulating layer over the first insulative layer and the conductive plug; forming an opening into the second insulating layer, the opening thereby forming a container shape; forming a conductive spacer adjacent the wall of the container form, the conductive spacer having inner and outer surfaces; removing the second insulating layer, thereby exposing the outer surface of the conductive spacer; forming a layer of hemispherical grained conductive material superjacent the inner and outer surfaces of the conductive spacer; forming insulating spacers adjacent the inner and outer surfaces of the hemispherical grained conductive material; patterning the hemispherical grained conductive material to form a separate conductive container structure serving as a first capacitor cell plate; removing the insulating spacers; forming a capacitor cell dielectric layer adjacent and coextensive the conductive container structure and the first insulating layer; and forming a second conductive layer superjacent and coextensive the capacitor cell dielectric layer, the second conductive layer forming a second capacitor cell plate. The process of the present invention can be further modified to form a DRAM double container capacitor storage cell.

We claim: 
     
       1. A process for fabricating a conductive container structure on a starting substrate, said process comprising the steps of: a) forming a first insulating layer over parallel conductive lines;   b) forming an opening through said first insulating layer between neighboring parallel conductive lines;   c) forming a conductive plug between said neighboring parallel conductive lines;   d) forming a planarized blanketing second insulating layer over said first insulative layer and said conductive plug;   e) forming an opening into said second insulating layer, said opening .Iadd.into said second insulating layer .Iaddend.thereby forming a container shape;   f) forming a conductive spacer adjacent the wall of said container .[.form.]. .Iadd.shape.Iaddend., said conductive spacer having inner and outer surfaces;   g) removing said second insulating layer thereby exposing said outer surface of said conductive spacer;   h) forming a layer of hemispherical grained conductive material superjacent said inner and outer surfaces of said conductive spacer;   i) forming insulating spacers adjacent the inner and outer surfaces of said hemispherical grained conductive material;   j) patterning said hemispherical grained conductive material to form a separate conductive container structure;   k) removing said insulating spacers;   l) forming a third insulating layer adjacent and coextensive said conductive container structure and said first insulating layer; and   m) forming a second conductive layer superjacent and coextensive said third insulating layer.   
     
     
       2. A process as recited in claim 1, wherein said conductive plug comprises conductively doped polysilicon. 
     
     
       3. A process as recited in claim 1, wherein said first insulating layer is silicon nitride. 
     
     
       4. A process as recited in claim 1, wherein said second insulating layer is silicon oxide. 
     
     
       5. A process as recited in claim 1, wherein said conductive spacer comprises conductively doped polysilicon. 
     
     
       6. A process as recited in claim 1, wherein said hemispherical grained conductive material comprises conductively doped hemispherical grained polysilicon. 
     
     
       7. A process as recited in claim 1, wherein said insulating spacers are silicon oxide. 
     
     
       8. A process as recited in claim 1, wherein said third insulating layer is silicon nitride. 
     
     
       9. A process as recited in claim 1, wherein said second conductive layer comprises conductively doped polysilicon. 
     
     
       10. A process for fabricating a conductive double container structure on a starting substrate, said process comprising the steps of: a) forming a first insulating layer over parallel conductive lines;   b) forming an opening through said first insulating layer between neighboring parallel conductive lines;   c) forming a .Iadd.first .Iaddend.conductive plug between said neighboring parallel conductive lines;   d) forming a planarized blanketing second insulating layer over said first insulative layer and said .Iadd.first .Iaddend.conductive plug;   e) forming an opening into said second insulating layer .Iadd.over said first conductive plug.Iaddend., said opening .Iadd.into said second insulating layer .Iaddend.thereby forming a container shape;   f) forming a conformal conductive layer adjacent the wall of said container .[.form.]. .Iadd.shape.Iaddend.;   g) forming a third insulating layer .Iadd.over said conductive layer.Iaddend.;   h) removing portions of said third insulating layer and said conductive layer such that said conductive layer is separated into L-shaped structures, said L-shaped conductive structures having inner and outer surfaces with vertical insulating spacers adjacent the inner portions of said L-shaped structures;   i) forming a .Iadd.second .Iaddend.conductive plug between said insulating spacers, said .Iadd.second .Iaddend.conductive plug making contact to said L-shaped structures and said first conductive plug;   j) removing said insulating spacers and said second insulating layer, thereby exposing said inner and outer surfaces of said L-shaped structures;   k) forming a layer of hemispherical grained conductive material superjacent said inner and outer surfaces of said L-shaped structures;   l) forming insulating spacers adjacent the inner and outer surfaces of said hemispherical grained conductive material;   m) patterning said hemispherical grained conductive material to form a separate conductive double container structure;   n) removing said insulating spacers;   o) forming a third insulating layer adjacent and coextensive said conductive double container structure and said first insulating layer; and   p) forming a second conductive layer superjacent and coextensive said third insulating layer.   
     
     
       11. A process as recited in claim 10, wherein said first conductive plug comprises conductively doped polysilicon. 
     
     
       12. A process as recited in claim 10, wherein said first insulating layer is silicon nitride. 
     
     
       13. A process as recited in claim 10, wherein said second insulating layer is silicon oxide. 
     
     
       14. A process as recited in claim 10, wherein said conformal conductive layer comprises conductively doped polysilicon. 
     
     
       15. A process as recited in claim 10, wherein said third insulating layer is silicon oxide. 
     
     
       16. A process as recited in claim 10, wherein said second conductive plug comprises conductively doped polysilicon. 
     
     
       17. A process as recited in claim 10, wherein said hemispherical grained conductive material comprises conductively doped hemispherical grained polysilicon. 
     
     
       18. A process as recited in claim 10, wherein said insulating spacers are silicon oxide. 
     
     
       19. A process as recited in claim 10, wherein said third insulating layer is silicon nitride. 
     
     
       20. A process as recited in claim 10, wherein said second conductive layer comprises conductively doped polysilicon. 
     
     
       21. A process for fabricating a DRAM container storage capacitor on a silicon substrate having active areas, word lines and digit lines, said process comprising the steps of: a) forming a first insulating layer over parallel conductive lines;   b) forming an opening through said first insulating layer between neighboring parallel conductive lines;   c) forming a conductive plug between said neighboring parallel conductive .[.word.]. lines;   d) forming a planarized blanketing second insulating layer over said first insulative layer and said conductive plug;   e) forming an opening into said second insulating layer, said opening .Iadd.into said second insulating layer .Iaddend.thereby forming a container shape;   f) forming a conductive spacer adjacent the wall of said container .[.form.]. .Iadd.shape.Iaddend., said conductive spacer having inner and outer surfaces;   g) removing said second insulating layer, thereby exposing said outer surface of said conductive spacer;   h) forming a layer of hemispherical grained conductive material superjacent said inner and outer surfaces of said conductive spacer;   i) forming insulating spacers adjacent the inner and outer surfaces of said hemispherical grained conductive material;   j) patterning said hemispherical grained conductive material to form a separate conductive container structure serving as a first capacitor cell plate;   k) removing said insulating spacers;   l) forming a capacitor cell dielectric layer adjacent and coextensive said conductive container structure and said first insulating layer; and   m) forming a second conductive layer superjacent and coextensive said capacitor cell dielectric layer, said second conductive layer forming a second capacitor cell plate.   
     
     
       22. A process as recited in claim 21, wherein said conductive plug comprises conductively doped polysilicon. 
     
     
       23. A process as recited in claim 21, wherein said first insulating layer is silicon nitride. 
     
     
       24. A process as recited in claim 21, wherein said second insulating layer is silicon oxide. 
     
     
       25. A process as recited in claim 21, wherein said conductive spacer comprises conductively doped polysilicon. 
     
     
       26. A process as recited in claim 21, wherein said hemispherical grained conductive material comprises conductively doped hemispherical grained polysilicon. 
     
     
       27. A process as recited in claim 21, wherein said insulating spacers are silicon oxide. 
     
     
       28. A process as recited in claim 21, wherein said third insulating layer is silicon nitride. 
     
     
       29. A process as recited in claim 21, wherein said second conductive layer comprises conductively doped polysilicon. 
     
     
       30. A process for fabricating a DRAM double container storage capacitor on a silicon substrate having active areas, word lines and digit lines, said process comprising the steps of: a) forming a first insulating layer over parallel conductive lines;   b) forming an opening through said first insulating layer between neighboring parallel conductive lines;   c) forming a .Iadd.first .Iaddend.conductive plug between said neighboring parallel conductive .[.word.]. lines;   d) forming a planarized blanketing second insulating layer over said first insulative layer and said .Iadd.first .Iaddend.conductive plug;   e) forming an opening into said second insulating layer .Iadd.over said first conductive plug.Iaddend., said opening .Iadd.into said second insulating layer .Iaddend.thereby forming a container shape;   f) forming a conformal conductive layer adjacent the wall of said container .[.form.]. .Iadd.shape.Iaddend.;   g) forming a third insulating layer .Iadd.over said conductive layer.Iaddend.;   h) etching said third insulating layer and said conductive layer such that said conductive layer is separated into L-shaped structures, said L-shaped conductive structures having inner and outer surfaces with vertical insulating spacers adjacent the inner portions of said L-shaped structures;   i) forming a .Iadd.second .Iaddend.conductive plug between said insulating spacers, said .Iadd.second .Iaddend.conductive plug making contact to said L-shaped structures and said first conductive plug;   j) removing said insulating spacers and said second insulating layer, thereby exposing said inner and outer surfaces of said L-shaped structures;   k) forming a layer of hemispherical grained conductive material superjacent said inner and outer surfaces of said L-shaped structures;   l) forming insulating spacers adjacent the inner and outer surfaces of said hemispherical grained conductive material;   m) patterning said hemispherical grained conductive material to form a separate conductive double container structure serving as a first capacitor cell plate;   n) removing said insulating spacers;   o) forming a capacitor cell dielectric layer adjacent and coextensive said conductive double container structure and said first insulating layer; and   p) forming a second conductive layer superjacent and coextensive said capacitor cell dielectric layer, said second conductive layer forming a second capacitor cell plate.   
     
     
       31. A process as recited in claim 30, wherein said first conductive plug comprises conductively doped polysilicon. 
     
     
       32. A process as recited in claim 30, wherein said first insulating layer is silicon nitride. 
     
     
       33. A process as recited in claim 30, wherein said second insulating layer is silicon oxide. 
     
     
       34. A process as recited in claim 30, wherein said conformal conductive layer comprises conductively doped polysilicon. 
     
     
       35. A process as recited in claim 30, wherein said third insulating layer is silicon oxide. 
     
     
       36. A process as recited in claim 30, wherein said second conductive plug comprises conductively doped polysilicon. 
     
     
       37. A process as recited in claim 30, wherein said hemispherical grained conductive material comprises conductively doped hemispherical grained polysilicon. 
     
     
       38. A process as recited, in claim 30, wherein said insulating spacers are silicon oxide. 
     
     
       39. A process as recited in claim 30, wherein said third insulating layer is silicon nitride. 
     
     
       40. A process as recited in claim 30, wherein said second conductive layer comprises conductively doped polysilicon. .Iadd. 
     
     
       41.  A process for fabricating a conductive container structure on a starting substrate, said process comprising the steps of: providing a substrate assembly having a first insulating layer thereon;   forming a second insulating layer over said first insulative layer;   forming an opening into said second insulating layer, said opening forming a container form;   forming a conductive spacer adjacent the wall of said container form, said conductive spacer having inner and outer surfaces;   removing said second insulating layer thereby exposing said outer surface of said conductive spacer;   depositing a layer of hemispherical grained conductive material superjacent said inner and outer surfaces of said conductive spacer;   forming insulating spacers over the layer of hemispherical grained conductive material;   patterning the hemispherical grained conductive material to form a container structure;   removing the insulating spacers;   forming a third insulating layer adjacent said container structure; and   forming a second conductive layer superjacent said third insulating layer..Iaddend..Iadd.   
     
     
       42.  A process as recited in claim 41, wherein said first insulating layer is silicon nitride..Iaddend..Iadd.43. A process as recited in claim 41, wherein said second insulating layer is silicon oxide..Iaddend..Iadd.44. A process as recited in claim 41, wherein said conductive spacer comprises conductively doped polysilicon..Iaddend..Iadd.45. A process as recited in claim 41, wherein said hemispherical grained conductive material comprises conductively doped hemispherical grained polysilicon..Iaddend..Iadd.46. A process as recited in claim 41, wherein said third insulating layer is 
     
     
        silicon nitride..Iaddend..Iadd.47.  A process as recited in claim 41, wherein said second conductive layer comprises conductively doped polysilicon..Iaddend..Iadd.48. A process for fabricating a conductive container structure on a starting substrate, said process comprising the steps of: providing a substrate assembly having a first insulating layer thereon;   forming a second insulating layer over said first insulative layer;   forming an opening into said second insulating layer, said opening forming a container form;   forming a conductive spacer adjacent the wall of said container form, said conductive spacer having inner and outer surfaces;   removing said second insulating layer thereby exposing said outer surface of said conductive spacer;   depositing a layer of hemispherical grained conductive material comprising hemispherical grained polysilicon adjacent said inner and outer surfaces of said conductive spacer;   forming insulating spacers over the layer of hemispherical grained conductive material;   patterning the hemispherical grained conductive material to form a container structure;   removing the insulating spacers;   forming a third insulating layer adjacent said conductive container structure; and   forming a second conductive layer superjacent said third insulating layer..Iaddend.