Electrodeposition process

Abstract

The disclosure is directed to an electrodeposition process utilizing molds of original objects. The molds are placed, preferably horizontally, into the electrodeposition bath. The resulting product utilizes the mold-facing surface as the final surface of the product. The disclosure is also directed to a process for making molds useful for the electrodeposition process of the invention. The process is particularly useful for producing metal reproductions of original artworks.

What is claimed is: 
     
       1. A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object, the elastic mold being essentially non-reactive to an electrodeposition solution;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold;   (f) placing the mold comprising the conductive means into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) providing weighting means to the elastic mold for preventing the elastic mold from floating in the electrodeposition bath;   (h) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (i) removing the mold from the electrodeposition bath; and   (j) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having a substantially similar configuration to the surface configuration of the original object.   
     
     
       2. The process of claim 1 wherein the elastic molding material comprises a polymeric material. 
     
     
       3. The process of claim 1 wherein the mold is disposed horizontally in the electrodeposition bath with the object-facing surface of the mold facing upward and the anode disposed above the object-facing surface. 
     
     
       4. The process of claim 3 wherein a screen is disposed between the anode and the mold. 
     
     
       5. The process of claim 1 wherein in step (h), metal is electrodeposited onto the mold for a sufficient time to form surface irregularities. 
     
     
       6. The process of claim 1 wherein backing material is affixed to the back surface of the metal deposit before detaching the metal deposit from the mold in step (j). 
     
     
       7. The process of claim 6 wherein the backing material comprises a polymeric material. 
     
     
       8. The process of claim 6 wherein at least one additive selected from the group consisting of anti-oxidants, surfactants, and chemical buffers, is disposed in the backing material. 
     
     
       9. The process of claim 6 wherein the backing material comprises strengthening means for providing structural stability to the metal deposit and backing material. 
     
     
       10. The process of claim 9 wherein the strengthening means comprises at least one member selected from the group consisting of powders, ions, particles, droplets, fibers, cloths, fabrics, textiles, screens, and sheets. 
     
     
       11. The process of claim 6 wherein the backing material comprises mounting means for attaching the electrodeposited metal product to an object or surface. 
     
     
       12. The process of claim 1 wherein the mold-facing surface of the electrodeposited metal product obtained in step (i) is treated by at least one process selected from the group consisting of polishing, brightening, grinding, brushing, chemical oxidation, and corrosion protection. 
     
     
       13. The process of claim 1 useful for producing artwork. 
     
     
       14. The process of claim 1 wherein the weighting means comprises at least one member selected from the group consisting of shot and heavy powders. 
     
     
       15. A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object and providing mold deformation prevention means to the elastic mold by: (i) applying a first layer of molding material to cover the surface of the original object;   (ii) allowing the first layer of molding material to substantially cure or solidify;   (iii) applying a second layer of molding material atop the first layer of cured or solidified molding material to form a bond between the first and second layers;   (iv) applying the molding deformation prevention means atop the second layer and allowing the mold deformation prevention means to settle in the second layer before the second layer cures or solidifies, thereby bonding the second layer to the mold deformation prevention means; and   (v) allowing the second layer comprising the mold deformation prevention means to cure or solidify.     (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object, the elastic mold being essentially non-reactive to an electrodeposition solution;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold;   (f) placing the mold comprising the conductive means into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (h) removing the mold from the electrodeposition bath; and   (i) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having a substantially similar configuration to the surface configuration of the original object.   
     
     
       16. The process of claim 15 wherein the mold deformation prevention means comprises at least one member selected from the group consisting of fibers, cloths, textiles, fabrics, and flexible screens. 
     
     
       17. The process of claim 15 wherein the mold deformation prevention means is substantially enclosed in the second layer to prevent exposure of the mold deformation prevention means to the electrodeposition solution during electrodeposition. 
     
     
       18. The process of claim 15 wherein in step (b)(iv), weighting means is added to the second layer before the second layer cures or solidifies, whereby the weighting means prevents the elastic mold from floating in the electrodeposition bath. .Iadd. 
     
     
       19.  The process of claim 1 wherein the mold is disposed vertically in the electrodeposition bath. .Iaddend. .Iadd.20. The process of claim 5 wherein the surface irregularities provide at least one effect selected from the group consisting of electrical effects, magnetic effects and structural 
     
     
        effects. .Iaddend. .Iadd.21.  The process of claim 5 wherein the surface irregularities comprise at least one structural member selected from the group consisting of powders, particles, droplets fibers, cloths, fabrics, textiles, screens and sheets. .Iaddend. .Iadd.22. The process of claim 1 wherein the weighting means comprises affixing the mold in position in the electrodeposition bath. .Iaddend. .Iadd.23. The process of claim 1 further comprising mold deformation prevention means for preventing deformation of the elastic mold in the electrodeposition bath. .Iaddend. .Iadd.24. The process of claim 1 wherein the conductive means comprises conductive means disposed within the mold. .Iaddend. .Iadd.25. The process of claim 24 wherein the conductive means disposed within the mold comprises conductive particles. .Iaddend. .Iadd.26. The process of claim 1 wherein the conductive means comprises a conductive deposit applied to the mold. 
     
     
        .Iaddend. .Iadd.27.  A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold;   (f) placing the mold comprising the conductive means into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) providing mold floating prevention means to prevent the elastic mold from floating in the electrodepositon bath;   (h) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (i) removing the mold from the electrodeposition bath; and   (j) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having a substantially similar configuration to the surface configuration of the original object. .Iaddend. .Iadd.28. The process of claim 27 wherein metal is electrodeposited onto the mold for a sufficient time to form surface   
     
     
        irregularities. .Iaddend. .Iadd.29.  The process of claim 28 wherein the surface irregularities provide at least one effect selected from the group consisting of electrical effects, magnetic effects and structural effects. .Iaddend. .Iadd.30. The process of claim 27 wherein the surface irregularities comprise at least one structural member selected from the group consisting of powders, particles, droplets, fibers, cloths, fabrics, textiles, screens and sheets. .Iaddend. .Iadd.31. The process of claim 27 further comprising mold deformation prevention means for preventing deformation of the elastic mold in the electrodeposition bath. .Iaddend. .Iadd.32. The process of claim 27 wherein the conductive means comprises conductive means disposed within the mold. .Iaddend. .Iadd.33. The process of claim 32 wherein the conductive means disposed within the mold comprises conductive particles. .Iaddend. .Iadd.34. The process of claim 27 wherein the conductive means comprises a conductive deposit applied to the mold. .Iaddend. .Iadd.35. The process of claim 27 wherein the mold floating prevention means comprises means disposed within the mold. .Iaddend. .Iadd.36. The process of claim 27 wherein the mold floating 
     
     
        prevention means comprises weighting means. .Iaddend. .Iadd.37.  The process of claim 27 wherein the mold floating prevention means comprises affixing the mold in position in the electrodeposition bath. .Iaddend. .Iadd.38. A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold;   (f) placing the mold comprising the conductive means into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) providing mold deformation prevention means for preventing deformation of the elastic mold while in the electrodeposition bath;   (h) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (i) removing the mold from the electrodeposition bath, and   (j) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having a substantially similar configuration to the surface configuration of the original object.   
     
     
        .Iaddend. .Iadd.39.  The process of claim 38 wherein metal is electrodeposited onto the mold for a sufficient time to form surface irregularities. .Iaddend. .Iadd.40. The process of claim 39 wherein the surface irregularities provide at least one effect selected from the group consisting of electrical effects, magnetic effects and structural effects. .Iaddend. .Iadd.41. The process of claim 39 wherein the surface irregularities comprise at least one structural member selected from the group consisting of powders, particles, droplets, fibers, cloths, fabrics, textiles, screens and sheets. .Iaddend. .Iadd.42. The process of claim 38 wherein the mold deformation prevention means is disposed within the mold. .Iaddend. .Iadd.43. The process of claim 38 wherein the mold deformation prevention means is disposed outside the mold. .Iaddend. .Iadd.44. The process of claim 38 wherein the mold deformation prevention means comprises a rigid support. .Iaddend. .Iadd.45. The process of claim 38 wherein the mold deformation prevention means comprises at least one material selected from the group consisting of fibers, cloths, textiles, 
     
     
        fabrics, and screens. .Iaddend. .Iadd.46.  The process of claim 38 wherein the conductive means comprises conductive means disposed within the mold. .Iaddend. .Iadd.47. The process of claim 46 wherein the conductive means disposed within the mold comprises conductive particles. .Iaddend. .Iadd.48. The process of claim 38 wherein the conductive means comprises a 
     
     
        conductive deposit applied to the mold. .Iaddend. .Iadd.49.  A process for electrodepositing and forming a composite material on a mold comprising the following steps: (a) providing a mold for electrodeposition thereon;   (b) providing conductive means to the mold;   (c) placing the mold comprising the conductive means horizontally into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (d) electrodepositing metal onto the mold;   (e) providing by vertical gravitation downward onto the horizontally disposed mold at least one structural material selected from the group consisting of powders, particles, droplets, fibers, cloths, fabrics, textiles, and screens to the electrodeposited metal to form a metal   
     
     
        composite. .Iaddend. .Iadd.50.  The process of claim 49 wherein the mold comprises an elastic material. .Iaddend. .Iadd.51. The process of claim 49 wherein the metal composite deposit provides at least one effect selected from the group consisting of electrical effects and magnetic effects. .Iaddend. .Iadd.52. The process of claim 49 further comprising mold floating prevention means for preventing the mold from floating in the 
     
     
        electrodeposition bath. .Iaddend. .Iadd.53.  A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object, the elastic mold being essentially non-reactive to an electrodeposition solution;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold;   (f) placing the mold comprising the conductive means horizontally into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (h) removing the mold from the electrodeposition bath; and   (i) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having an essentially exact configuration   
     
     
        to the surface configuration of the original object. .Iaddend. .Iadd.54. A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object, the elastic mold being essentially non-reactive to an electrodeposition solution;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold;   (f) placing the mold comprising the conductive means vertically into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (h) removing the mold from the electrodeposition bath; and   (i) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having an essentially exact configuration   
     
     
        to the surface configuration of the original object. .Iaddend. .Iadd.55. A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object, the elastic mold being essentially non-reactive to an electrodeposition solution;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold;   (f) placing the mold comprising the conductive means into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit and surface irregularities on the object-facing surface of the mold;   (h) removing the mold from the electrodeposition bath; and,   (i) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having an essentially exact configuration   
     
     
        to the surface configuration of the original object. .Iaddend. .Iadd.56. The process of claim 55 wherein the surface irregularities provide at least one effect selected from the group consisting of electrical effects, magnetic effects and structural effects. .Iaddend. .Iadd.57. The process of claim 55 wherein the surface irregularities comprise at least one structural member selected from the group consisting of powders, particles, droplets, fibers, cloths, fabrics, textiles, screens and sheets. .Iaddend. .Iadd.58. A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object, the elastic mold being essentially non-reactive to an electrodeposition solution;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means disposed within the mold to the object-facing surface of the mold;   (f) placing the mold comprising the conductive means into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (h) removing the mold from the electrodeposition bath; and   (i) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having an essentially exact configuration   
     
     
        to the surface configuration of the original object. .Iaddend. .Iadd.59. The process of claim 58 wherein the conductive means disposed within the mold comprises conductive particles. .Iaddend. .Iadd.60. A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object, the elastic mold being essentially non-reactive to an electrodeposition solution;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold, the conductive means comprising a conductive deposit applied to the mold;   (f) placing the mold comprising the conductive means into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (g) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (h) removing the mold from the electrodeposition bath; and   (i) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having an essentially exact configuration   
     
     
        to the surface configuration of the original object. .Iaddend. .Iadd.61. A process for electrodepositing a metal on a mold comprising the following steps: (a) obtaining an original solid object comprising a surface configuration which is to be essentially duplicated by the electrodeposition process;   (b) applying an elastic molding material to the surface of the original object;   (c) allowing the elastic molding material to cure or solidify to obtain a solid elastic mold comprising an object-facing surface configuration which is in a reverse configuration to the surface configuration of the object, the elastic mold being essentially non-reactive to an electrodeposition solution;   (d) removing the elastic mold from the surface of the original object;   (e) providing conductive means to the object-facing surface of the mold;   (f) providing mold floating prevention means for preventing the mold from floating in the electrodeposition bath;   (g) placing the mold comprising the conductive means into an electrodeposition bath, the electrodeposition bath comprising the electrodeposition solution and at least one anode;   (h) electrodepositing metal onto the object-facing surface of the mold for a sufficient time to form a metal deposit on the object-facing surface of the mold;   (i) removing the mold from the electrodeposition bath; and   (j) detaching the elastic mold from the metal deposit to produce an electrodeposited metal product comprising a mold-facing surface and a back surface, the mold-facing surface having an essentially exact configuration   
     
     
        to the surface configuration of the original object. .Iaddend. .Iadd.62. The process of claim 61 wherein the mold floating prevention means comprises weighting means.