Semiconductor integrated circuit packages

Abstract

A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.

What is claimed is: 
     
       1. A semiconductor integrated circuit package comprising: a semiconductor integrated circuit chip; a lead frame, said lead frame having a paddle on which said chip is mounted and paddle support arms; and an external mounting frame having a plurality of fingers, electrical connections from said chip to said fingers, said paddle being connected to said external mounting frame by said paddle support arms CHARACTERIZED IN THAT said paddle support arms comprise a deformation absorbing member, said paddle being depressed with respect to said external mounting frame, said deformation absorbing member localizing deformation during paddle downsetting and maintaining desired physical characteristics. 
     
     
       2. A package as recited in claim 1 in which said deformation absorbing member comprises a T bar. 
     
     
       3. A package as recited in claim 1 in which said deformation absorbing member comprises an S bend member. 
     
     
       4. A package as recited in claim 1 in which said deformation absorbing member comprises an annular member. 
     
     
       5. A package as recited in claim 1 in which said deformation absorbing member comprises a wrinkle member. .Iadd. 
     
     
       6.  A semiconductor integrated circuit package comprising: a semiconductor integrated circuit chip;   a paddle on which said chip is mounted;   a plurality of paddle support arms, said paddle being connected to said paddle support arms;   a plurality of fingers;   electrical connections from said chip to said fingers;   CHARACTERIZED IN THAT said paddle support arms comprise a deformation absorbing member, said paddle being depressed with respect to at least a portion of said fingers, said deformation absorbing member localizing deformation during paddle downsetting and maintaining desired physical characteristics. .Iaddend. .Iadd.7. A semiconductor integrated circuit package as recited in claim 6 in which deformation absorbing member comprises a T bar. .Iaddend. .Iadd.8. A semiconductor integrated circuit package as recited in claim 6 in which deformation absorbing member comprises an S bend member. .Iaddend. .Iadd.9. A semiconductor integrated circuit package as recited in claim 6 in which deformation absorbing member comprises an annular member. .Iaddend. .Iadd.10. A semiconductor integrated circuit package as recited in claim 6 in which deformation absorbing member comprises a wrinkle member. .Iaddend.