Alkaline benzylic ether phenolic resin binders

Abstract

Modified benzylic ether resole resins and process for their preparation. The resins are prepared by treating a phenol with a molar excess of aldehyde in the presence of a divalent metal ion catalyst at a pH below 7 followed by further reaction at a pH above 8 in the presence of an alkaline catalyst. Alkaline solutions of the resins are used as foundry binders in an ester cure process.

What is claimed is: .[.1. A process for preparing a modified benzylic ether resole resin comprising the steps: 
     
        sodium hydroxide and mixtures thereof..]. 15. A binder composition which comprises an aqueous alkaline solution of a phenolic resole resin, said aqueous solution having a solids content of from about 40% to about 75% by weight, said phenolic resole having an aldehyde:phenol molar ratio of from about 1.2:1 to about 2.6:1 and an alkali:phenol molar ratio of from about 0.2:1 to about 1.2:1, wherein the phenolic resole resin is the modified benzylic ether resole resin .[.of claim 8.]. .Iadd.obtained by a process comprising the steps of: (a) first reacting a phenol with a molar excess of an aldehyde in the presence of a divalent metal ion catalyst at a pH below 7 until from about 20% to about 90% by weight of the aldehyde has combined with the phenol;   (b) then adding sufficient basic catalyst to the mixture of step(a) to raise the pH to at least about 8; and   (c) heating the mixture obtained in step (b) until the free aldehyde in the   
     
     
        mixture is less than about 5% by weight of the mixture.Iaddend.. 16. The binder composition of claim 15 wherein the aldehyde:phenol molar ratio is 
     
     
        from about 1.5:1 to about 2.2:1. 17. The binder composition of claim 15 wherein the alkali used to prepare the aqueous alkaline solution is selected from the group consisting of potassium hydroxide, sodium 
     
     
        hydroxide and mixtures thereof. 18. The binder composition of claim 17 wherein the molar ratio of alkali to phenol is from about 0.4:1 to about 
     
     
        0.9:1. 19. The binder composition of claim 15 which further comprises an additive in an amount of at least about 1% by weight of the phenolic resole resin, said additive being soluble in the aqueous alkaline solution and having the general formula:   Ar--O--CHR.sup.1 --CHR.sup.2 --OH     where Ar=phenyl or phenyl substituted with one or more halogen, hydroxy, alkoxy or alkyl groups and where R 1  and R 2  may be the same or   
     
     
        different and=hydrogen, alkyl or alkoxy. 20. The binder composition of claim 19 wherein the additive is present in an amount of from about 2% to 
     
     
        about 6% by weight of the phenolic resole resin. 21. The binder 
     
     
        composition of claim 19 wherein the additive is phenoxyethanol. 22. A foundry molding composition which comprises a granular refractory material, and from about 0.5 to about 8% by weight of the refractory 
     
     
        material of the binder composition of claim 15. 23. The foundry molding composition of claim 22 wherein the granular refractory material is selected from the group consisting of silica sand, chromite sand, zircon 
     
     
        sand, olivine sand and mixtures thereof. 24. The foundry molding composition of claim 22 wherein the aqueous alkaline solution of a phenolic resole resin is present in an amount of about 1% to about 3% by 
     
     
        weight of the sand. 25. The foundry molding composition of claim 22 wherein the alkali used to prepare the aqueous alkaline solution is selected from the group consisting of potassium hydroxide, sodium 
     
     
        hydroxide and mixtures thereof. 26. The foundry molding composition of claim 25 wherein the molar ratio of alkali to phenol is from about 
     
     
        .[.0.4:.]. .Iadd.0.4:1 .Iaddend.to about 0.9:1. 27. The foundry molding 
     
     
        composition of claim 22 which further comprises a silane. 28. A foundry molding composition which comprises a granular refractory material, and from about 0.5 to about 8% by weight of the refractory material of the 
     
     
        binder composition of claim 19. 29. The foundry molding composition of claim 28 wherein the additive is present in an amount of from about 2% to 
     
     
        about 6% by weight of the phenolic resole resin. 30. The foundry molding 
     
     
        composition of claim 28 wherein the additive is phenoxyethanol. 31. A process for the production of foundry cores and molds which comprises: (a) mixing a granular refractory material with from about 0.5% to about 8% by weight of the refractory material of the binder of claim 15;   (b) placing the mixture of refractory material and binder in a vented core or mold box; and   
     
     
       (c) gassing the mixture in the core or mold box with a volatile ester. 32. The process of claim 31 wherein the granular refractory material is selected from the group consisting of silica sand, chromite sand, zircon 
     
     
        sand, olivine sand and mixtures thereof. 33. The process of claim 31 wherein the binder is present in an amount of about 1% to about 3% by 
     
     
        weight of the sand. 34. The process of claim 31 wherein the alkali used to prepare the aqueous alkaline solution of binder is selected from the group consisting of potassium hydroxide, sodium hydroxide and mixtures thereof. 
     
     
         5. The process of claim 34 wherein the ratio of alkali to phenol is from 
     
     
        about 0.4:1 to about 0.9:1. 36. The process of claim 31 wherein the 
     
     
        mixture of refractory material and binder further comprises a silane. 37. The process of claim 31 wherein the volatile ester is methyl formate. 
     
     
         8. A process for the production of foundry cores and molds which comprises: (a) mixing a granular refractory material with from about 0.5% to about 8% by weight of the refractory material of the binder of claim 19;   (b) placing the mixture of refractory material and binder in a vented core or mold box; and   
     
     
       (c) gassing the mixture in the core or mold box with a volatile ester. 39. The process of claim 38 wherein the additive is present in an amount 
     
     
        of from about 2% to about 6% by weight of the phenolic resole resin. 40. The process of claim 38 wherein the additive is phenoxyethanol.