Wafer transfer apparatus

Abstract

An automated system lifts a batch of semiconductor wafers from a slotted carrier, transfers them laterally and lowers them into a second slotted carrier. In doing this, jaws on the lifting apparatus open automatically to receive or release the wafers. With a carrier having relatively high slotted sides, such as the commonly used plastic cassette, a pusher engages the lower edge of the wafers exposed through the bottom of the cassette and pushes them upwardly sufficiently far to permit the lifter jaws to receive and lift the wafers. The apparatus is oriented at a slight angle to insure that the wafers are all arranged in precise, spaced, parallel relation so as to cooperate with slots in the lifter jaws and slots in the receiving carrier. The system has the capability to move two batches of 25 wafers to a quartz boat having 50 more-closely spaced slots, and similarly, two batches from a quartz boat may be transferred to two different plastic cassettes.

What is claimed is: 
     
       1. Apparatus for transferring a batch of thin, disk-like elements, such as semiconductor wafers, from one slotted carrier to another, wherein the flat faces of the wafers are leaning at a slight angle with respect to vertical so as to insure that they are precisely arranged in spaced parallel relation, comprising: a support surface for supporting a first slotted carrier carrying a batch of wafers arranged in edgewise, parallel, coaxial relation;   a lifter assembly located above said surface so that it may be positioned above said carrier for enclosing the wafers and for raising and lowering the wafers at said angle;   means for transferring the lifter assembly laterally so that the batch of wafers may be lowered by the lifter assembly into the slots of a second carrier and released; and   structure means for supporting the lifter assembly in a manner such that it is movable upwardly and downwardly at said angle so that the batch of wafers is inserted or withdrawn to and from the carriers in a direction parallel to the orientation of that angle.   
     
     
       2. The apparatus of claim 1 wherein said lifter assembly includes: a frame;   a pair of spaced elongated jaws pivotally mounted on the frame and movable into open or closed position, said jaws having a series of spaced slots for receiving the edges of a series of semiconductor wafers arranged in spaced parallel relation, said jaws, when in the open position, being able to receive the maximum diameter of the wafers and in the closed position the jaws spacing being less than the maximum diameter such that the wafers may be lifted when the jaws are closed and then moved upwardly.   
     
     
       3. The apparatus of claim 2 including means for automatically pivoting the jaws into the open and closed positions including spring means urging the jaws into closed position and motor means for moving the jaws into open position against the urging of the spring means. 
     
     
       4. The apparatus of claim 2 wherein said frame has a pair of spaced side members between which said jaws extend, the jaws being mounted on pivot shafts that extend through said side members, a link fixed to each of said shafts to that moving the links will pivot the jaws into the open and closed positions, said links extending towards each other with their adjacent ends in overlapping relation, means connecting the overlapping ends to cause them to move together while they pivot about their shaft mountings, means connected to said links, said motor and said spring, for transmitting jaw opening and closing forces to said links. 
     
     
       5. Apparatus of claim 4 wherein said links are arranged such that they are locked into the jaws closed position in a manner which requires the links to be driven by said motor out of said locked closed position into said opened position. 
     
     
       6. The apparatus of claim 1 wherein: said lifter assembly includes slotted lifter means for lifting a batch of wafers from a slotted carrier; and   said means for moving the lifter assembly laterally includes means for stopping the lifter assembly at first and second lateral positions so that a first batch of wafers can be lowered into the second carrier in first position and a second batch of wafers can be lowered into the second carrier at said second position with said second batch of wafers being interleaved with the first batch of wafers.   
     
     
       7. The apparatus of claim 6 wherein said lifter assembly includes a pair of jaws having a plurality of ribs defining a series of equally spaced, alternately arranged wafer lifter slots and wafer gaps, said first carrier has a plurality of slots spaced equally with the lifter slots, and said second carrier has a plurality of slots spaced equally with the lifter slots and gaps. 
     
     
       8. The apparatus of claim 7 wherein the lifter slots include projection means extending inwardly to provide a lifting surface for the wafers, and said gaps are dimensioned to not engage the wafers. 
     
     
       9. Apparatus for transferring a batch of thin, disk-like elements, such as semiconductor wafers, from one slotted carrier to another, comprising: a support surface .[.having an opening therethrough.]. .Iadd. for supporting a first carrier adapted .Iaddend.for .[.supporting.]. .Iadd.releasable containment of .Iaddend.a batch of wafers arranged in edgewise, parallel, coaxial relation .[.overlying said opening.]. wherein .[.the.]. flat faces of the wafers .Iadd.contained by said first carrier .Iaddend.are leaning at a slight angle with respect to vertical so as to insure that they are precisely arranged in spaced parallel relation;   a lifter assembly located .[.above.]. .Iadd.relative to .Iaddend.said surface so that it may be positioned above said .Iadd.first .Iaddend.carrier for enclosing .[.the wafers.]. and .[.for.]. .Iadd.thereby .Iaddend.raising .[..]. .Iadd.and/or .Iaddend.lowering the wafers .Iadd.relative to said first carrier; .Iaddend.   means .[.for transferring.]. .Iadd.positioning .Iaddend.the lifter assembly .[.laterally.]. .Iadd.at said slight angle .Iaddend.so that .[.the.]. .Iadd.a .Iaddend.batch of wafers .Iadd.enclosed by said lifter assembly .Iaddend.may be lowered by the lifter assembly into .[.the.]. slots of a second carrier and released .Iadd.thereto, or lifted away from said second carrier; .Iaddend.and including   means for supporting the lifter assembly .[.and pusher assembly.]. in a manner such that .[.they are.]. .Iadd.it is .Iaddend.moved upwardly and downwardly at said .Iadd.slight .Iaddend.angle so that the batch of wafers is inserted or withdrawn to and from the .Iadd.first and second .Iaddend.carriers in a direction .[.parallel to the orientation of that.]. .Iadd.in line with and at their wafer-supporting .Iaddend∠   
     
     
       10. The apparatus of claim 4, including .Iadd.a pusher assembly and further comprising: .Iaddend. means for controlling the pusher assembly, the lifter assembly, and the lateral transfer means so that the batch of wafers is transferred automatically from said first carrier to said second carrier.   
     
     
       11. Apparatus for transferring a batch of thin, disk-like elements, such as semiconductor wafers, from one slotted carrier to another, comprising: a support surface having an opening therethrough for supporting a .Iadd.first carrier of the type which holds a batch of wafers arranged in edgewise, parallel, coaxial relation overlying said opening;   a lifter assembly located above said surface so that .[.it.]. .Iadd.said lifter .Iaddend.may be positioned above said .Iadd.first .Iaddend.carrier for enclosing the wafers and for raising and lowering the wafers;   means for transferring the lifter assembly laterally so that the batch of .Iadd.lifter-enclosed .Iaddend.wafers may be lowered by the lifter assembly into .[.the.]. slots of a second carrier and released;   a pusher assembly located below the support surface, including means which is movable upwardly through the opening in the support surface and through a slot in .[.the.]. .Iadd.a .Iaddend.bottom of the .Iadd.first and/or second .Iaddend.carrier to engage .[.the.]. bottom edges of the wafers and to push the wafers upwardly; and   a carriage mounted for lateral movement, means on said carriage for supporting said pusher assembly for upward and downward movement, and means on said carriage for supporting the lifter assembly for up and down movement, said means for transferring the lifter assembly laterally being the means for transferring the carriage laterally.   
     
     
       12. A method of transferring a batch of spaced parallel semiconductor wafers from one slotted carrier to a second slotted carrier, comprising: .[.positioning the carriers in side by side relation;.].   lowering a lifting assembly over .[.the.]. .Iadd.a first .Iaddend.carrier filled with wafers;   engaging and lifting the batch of wafers .[.upwardly.]. out of .[.the.]. .Iadd.a .Iaddend.first carrier;   .[.moving.]. .Iadd.positioning .Iaddend.the batch of wafers .[.laterally to be.]. .Iadd.so that they are .Iaddend.aligned above .[.the.]. slots of .[.the.]. .Iadd.a .Iaddend.second carrier;   lowering the batch of wafers into .[.the.]. slots of the second carrier;   releasing the wafers; and   including the step of tilting the .[.first carrier.]. .Iadd.wafers relative to said carriers .Iaddend.slightly so that the wafers .[.in the carrier.]. .Iadd.during wafer transfer into and out of said carriers .Iaddend.all lean in the same direction at a slight angle with respect to vertical .Iadd.and .Iaddend.wherein said lowering and lifting steps are done at said angle.   
     
     
       13. The method of claim 12 including .Iadd.the additional step of .Iaddend.pushing the wafers in the first carrier upwardly from below the .Iadd.first .Iaddend.carrier before attempting to lift the wafers from above the .Iadd.first .Iaddend.carrier. 
     
     
       14. The method of claim 12 including the steps of receiving the wafers .[.in said second carrier.]. in a pusher assembly that extends upwardly through the bottom of the second carrier, and then lowering the batch of wafers into .[.the.]. slots of the second carrier. 
     
     
       15. The method of claim 12 wherein the wafers can be transferred from the first carrier to the second carrier or the second carrier to the first, and including the step of pushing the wafers upwardly from below the first carrier before attempting to lift the wafers, or utilizing the pusher to receive and .Iadd.to .Iaddend.lower the .[.batch of.]. wafers .[.in transferring the wafers.]. from the second carrier to the first. 
     
     
       16. The method of claim .[.15.]. .Iadd.12 .Iaddend.wherein .[.the first carrier.]. .Iadd.one of the carriers .Iaddend.has a plurality of vertically extending slots for receiving wafers and the .[.second carrier.]. .Iadd.the other of said carriers.Iaddend.has a plurality of .Iadd.angled .Iaddend.slots for receiving wafers .[.and.]. arranged so that all the wafers lean at said angle .Iadd.with respect to vertical .Iaddend.and have their axes extending horizontally and including the .[.initial.]. .Iadd.additional .Iaddend.step of tilting the first carrier .Iadd.relative to the lifting assembly .Iaddend.so that the wafers of the first carrier all lean at said same angle .Iadd.prior to said wafer transfer step..Iaddend. .[. 
     
     
       17.  The method of claim 16 wherein said pushing step changes the axes of the wafers to horizontal as the wafers are pushed out of said first carrier..]. .Iadd. 
     
     
       18.  Apparatus for transferring a batch of thin, disk-like elements, such as semiconductor wafers, from one slotted carrier to another, wherein the flat faces of the wafers are leaning at a slight angle with respect to vertical in at least one of said carriers tending to arrange said wafers in a uniformly spaced parallel relation, said apparatus comprising: a support surface for supporting a first slotted carrier adapted to carry a batch of wafers arranged in edgewise, parallel relation;   a wafer transfer assembly located above said surface so that it may be positioned above either carrier, for receiving and supporting said wafers at said angle with respect to vertical, said assembly including a pair of horizontally oriented and elongated jaws movable into open or closed position, said jaws having a series of spaced slots oriented at said angle for receiving the edges of said wafers; and   means for controlling said jaws of said assembly so that said batch of wafers is aligned with the slots in the first and therefor the second carrier at time of wafer transfer by said assembly..Iaddend. .Iadd.19. A method of transferring a batch of spaced, parallel semiconductor wafers from one carrier, having a plurality of slots for supporting the bath of wafers in spaced, parallel, coaxial relation, to or from a second carrier having a plurality of slots for supporting the batch of wafers in spaced, parallel relation, said method characterized by having at least one of said carriers of the angle slotted type, and comprising the steps of;   arranging the relative orientation of said carriers so that the slots in both carriers will support a batch of wafers in one carrier parallel to a batch of wafers supported in the other carrier with said wafers at a slight angle to the vertical; and   moving a batch of wafers at said angle from one carrier to the other while maintaining the wafers in said parallel relation..Iaddend. .Iadd.20. A wafer transfer apparatus for transferring a batch of wafers from a vertical slotted carrier to an angle slotted carrier, said apparatus comprising:   means for grasping said batch of wafers while said wafers are coaxially aligned with each other in said batch in one of said carriers;   means for aligning the grasped wafers to be transferred in accordance with the slot alignment of either type carrier; and   means for transferring said batch of wafers to or from the other type carrier at an alignment that is a common angle and direction for both of   
     
     
        said carriers..Iaddend. .Iadd.21.  A method of wafer transfer for transferring a batch of wafers to/from a vertical slotted carrier to/from an angle slotted carrier, comprising the steps of: aligning a grasping means so that it may grasp said batch of wafers while said wafers are coaxially aligned with each other in said batch in one of said slotted carriers;   aligning the grasped wafers to be transferred in accordance with the slot alignment of said other type carrier; and   orienting at least one of said carriers relative to said transferring means so that said grasped batch of wafers may be moved to/from either type of said carriers to the other type thereof at a common direction and   
     
     
        angle..Iaddend. .Iadd.22.  Apparatus for transferring a batch of spaced, parallel semiconductor wafers from one carrier, having a plurality of slots for supporting the batch of wafers in spaced, parallel, coaxial relation, to or from a second carrier having a plurality of slots for supporting the batch of wafers in spaced, parallel relation, said apparatus characterized by having at least one of said carriers of the angle slotted type, and comprising; means for positioning the relative orientation of said carriers so that the slots in both carriers will support a batch of wafers in one carrier parallel to a batch of wafers supported in the other carrier with said wafers at a slight angle to the vertical; and   means for moving a batch of wafers at said angle from one carrier to the other while maintaining the wafers in said parallel relation..Iaddend.