USRE33079EExpiredUtility
Homopolymerization of acetylene substituted polyimide polymers
Priority: Nov 6, 1973Filed: Mar 5, 1979Granted: Oct 3, 1989
Est. expiryNov 6, 1993(expired)· nominal 20-yr term from priority
C07C 205/38C08G 73/101
47
PatentIndex Score
10
Cited by
11
References
5
Claims
Abstract
Polyimides are prepared from acetylene substituted polyimide oligomers via an addition polymerization reaction which involves homopolymerization. These polymers exhibit low void content when cured and possess superior thermal stability characteristics and physical properties such as structural strength. One of their unique properties is their ability to be processed into useful articles at moderate pressures and temperatures.
Claims
exact text as granted — not AI-modifiedWe claim:
1. A cured resin derived by the homopolymerization of acetylene substituted polymide oligomer having the following general structure: ##STR7## wherein R is ##STR8## wherein Z is O, CH 2 , S, CO, SO 2 --CF 2 -- m , or --CF 2 --O--CF 2 --, and wherein n is 0-5, m is 0-5, and wherein R' is O, S, CO, CH 2 , SO 2 , --CF 2 -- m , or --CF 2 --O--CF 2 --, and wherein X is O, S, CH 2 , CO, SO 2 --CF 2 -- m , or --CF 2 --O--CF 2 --, and wherein n' .[.is 0.]. .Iadd.average about 1 .Iaddend.to 5 and n" is 0 to 5.
2. A resin of claim 1 wherein R is as defined above X is CO, n' is 0, R' is 0 n"is 1.
3. The process of producing cured resins of claim 1 comprised of heating said acetylene substituted polyimide oligomer at elevated temperatures ranging from 190°-600°C at a pressure from about 15 psi to about 200 psi.
4. The process of producing cured resin of claim 1 comprised of heating acetylene substituted polyimide oligomer at elevated temperatures in the presence of catalyst taken from the group comprosed of Ziegler catalyst, Friedel Craft catalyst or non Friedel Craft organo metallic catalyst. .Iadd.
5. A cured resin as set forth in claim 1, wherein said resin is incorporated as part of a laminate. .Iaddend. .Iadd.6. A cured resin as set forth in claim 2, wherein said resin is incorporated as part of a laminate. .Iaddend. .Iadd.7. The process as set forth in claim 3, wherein said heating of said oligomer is accomplished after said oligomer is
incorporated as part of a laminate. .Iaddend. .Iadd.8. The process as set forth in claim 4, wherein said heating of said oligomer is accomplished after said oligomer is incorporated as part of a laminate. .Iaddend.Join the waitlist — get patent alerts
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