Low thermal expansivity and high thermal conductivity substrate

Abstract

A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20×10 -7 to about 50×10 -7 in/in/°C. Second material particles having a coefficient of thermal expansion in the range of about 100×10 -7 to about 200×10 -7 in/in/°C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1×10 -7 to about 50×10 -7 in/in/°C.

I claim: 
     
       1. A composite adapted to be a substrate for an electronic application, comprising a mixture of: first material particles having a coefficient of thermal expansion in the range of about -20×10 -7  to about 50×10 -7  in/in/°C.;   second material particles mixed with said first material particles having a coefficient of thermal expansion in the range of about 100×10 -7  to about .[.200.]. .Iadd.274.Iaddend.×10 -7  in/in/°C.; and   a bonding agent to adhere the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1×10 -7  to about 50×10 -7  in/in/°C.   
     
     
       2. A composite as in claim 1 wherein said composite has a thermal conductivity in the range of about 65 to 230 BTU/ft/ft 2  /hr/°F. 
     
     
       3. A composite as in claim 2 wherein said first material are particles selected from the group consisting of silica, ceramics, glass, metals and metal alloys. 
     
     
       4. A composite as in claim 3 wherein said first material is a ceramic. 
     
     
       5. A composite as in claim 3 wherein said first material is a silica. 
     
     
       6. A composite as in claim 3 wherein said first material is a glass. 
     
     
       7. A composite as in claim 1 wherein said bonding agent fills the interstices between the first and second material particles. 
     
     
       8. A composite as in claim 3 wherein said first material is a metal alloy. 
     
     
       9. A composite as in claim 8 wherein said first material is a nickel-iron alloy. 
     
     
       10. A composite as in claim 8 wherein said first material is an iron-nickel-copper alloy. 
     
     
       11. A composite as in claim 8 wherein said first material is molybdenum. 
     
     
       12. A composite as in claim 3 wherein said second material is selected from the group consisting of metals and metal alloys. 
     
     
       13. A composite as in claim 12 wherein said second material is copper. 
     
     
       14. A composite as in claim 12 wherein said second material is a copper alloy. 
     
     
       15. A composite as in claim 12 wherein said second material is aluminum. 
     
     
       16. A composite as in claim 12 wherein said second material is an aluminum alloy. 
     
     
       17. A composite as in claim 12 wherein said bonding agent is selected from the group consisting of glasses, organic adhesives, ceramics and metals. 
     
     
       18. A composite as in claim 17 wherein said composite is a strip. 
     
     
       19. A composite as in claim 18 further including a metallic foil bonded to at least one surface of the composite strip. 
     
     
       20. A composite as in claim 18 further including a continuous layer of low melting temperature glass coating on at least one surface of the composite stip. 
     
     
       21. A composite as in claim 17 wherein said bonding agent is glass. 
     
     
       22. A composite as in claim 17 wherein said bonding agent is an organic adhesive. 
     
     
       23. A composite as in claim 17 wherein said bonding agent is a ceramic. 
     
     
       24. A composite as in claim 17 wherein said bonding agent is a metal. .Iadd. 
     
     
       25.  A composite adapted to be a substrate for an electronic application, comprising a mixture of: first material particles having a coefficient of thermal expansion in the range of about -20×10 -7  to about 50×10 -7  in/in/°C.;   second material particles mixed with said first material particles having a coefficient of thermal expansion in the range of about 100×10 -7  to about 274×10 -7  in/in/°C.; and   a bonding agent to adhere the first and second material particles into a coherent composite having a coefficient of thermal expansion of about 1×10 -7  in/in/°C. to about 274×10 -7  in/in/°C..Iaddend. .Iadd.26. The composite as in claim 25 wherein said first material are particles selected from the group consisting of silica, ceramics, glass, metals and metal alloys..Iaddend. .Iadd.27. The composite as in claim 26 wherein said first material comprises a ceramic..Iaddend. .Iadd.28. The composite as in claim 26 wherein said first material comprises a silica..Iaddend. .Iadd.29. The composite as in claim 26 wherein said first material comprises a glass..Iaddend. .Iadd.30. The composite as in claim 26 wherein said first material comprises a metal   
     
     
        alloy..Iaddend. .Iadd.31.  The composite as in claim 26 further comprising said second material being selected from the group consisting of metals and metal alloys..Iaddend. .Iadd.32. The composite as in claim 31 further comprising said second material being copper..Iaddend. .Iadd.33. The composite as in claim 31 further comprising said second material being a copper alloy..Iaddend. .Iadd.34. The composite as in claim 31 further comprising said second material being aluminum..Iaddend. .Iadd.35. The composite as in claim 31 further comprising said second material being an aluminum alloy..Iaddend. .Iadd.36. The composite as in claim 31 further including said bonding agent being selected from the group consisting of glasses, organic adhesives, ceramics and metals..Iaddend. .Iadd.37. The composite as in claim 36 further including said bonding agent being a glass..Iaddend. .Iadd.38. The composite as in claim 36 further including 
     
     
        said bonding agent being an organic adhesive..Iaddend. .Iadd.39.  The composite as in claim 36 further including said bonding agent being a ceramic..Iaddend. .Iadd.40. The composite as in claim 36 further including said bonding agent being a metal..Iaddend.