System for fabrication of semiconductor bodies

Abstract

A system and method is provided for forming semiconductor tear-drop shaped bodies having minimal grain boundaries. Semiconductor material is melted in a capillary tube at the top of a tower, and forced under gas pressure through a nozzle. Separate semiconductor bodies are formed. They are passed through a free fall path over which a predetermined temperature gradient controls solidification of the bodies. The resultant bodies are tear-drop semiconductor bodies of near uniform size with minimal grain boundaries.

What is claimed is:  .[.1. A system for fabricating small semiconductor bodies, which comprises: 
     
        the top and hour-glass shape therebelow.  8. The combination set forth in claim 7, wherein said free fall path is of a length and the temperature is at levels therealong to slowly solidify said bodies.  .[.9. The combination set forth in claim 6 said capillary tube has a gas port and the upper end of said tube has a gas conduit leading thereto for selective flow of inert gas into said capillary tube and said elongated tube..].