Method of forming a laminate

Abstract

A method of forming a laminate is disclosed. The method comprises placing a metal film in juxtaposition to a surface to be joined thereto. A buffer medium having an explosive charge on at least one surface thereof is positioned proximate the film. The explosive charge is detonated to propel the film against the surface to shear a portion of the film, corresponding in shape to the surface, away from the buffer medium to bond the sheared portion to the surface.

We claim: 
     
       1. A method of forming a laminate, which comprises: a. placing a metal film in juxtaposition to a first surface to be joined thereto;   b. positioning a .Iadd.planar .Iaddend.buffer medium proximate said film, said buffer medium having an explosive charge on at least one surface thereof; and   c. detonating said explosive charge to propel said film against an edge of said first surface to shear at least a portion of said film from the remainder thereof, corresponding in shape to said first surface, to bond said sheared portion to said first surface.   
     
     
       2. A method of depositing a metal on a discrete portion of a metal pattern, which comprises: a. placing a metal film in juxtaposition to the portion;   b. positioning a .Iadd.planar .Iaddend.buffer medium proximate said film, said buffer medium having an explosive charge deposited on at least one surface thereof; and   c. detonating said explosive charge to propel said film against the discrete portion to shear a portion of said film from the remainder thereof, conforming in shape to the discrete portion, to bond said sheared portion only to the discrete portion.   
     
     
       3. A method of forming a printed circuit, which comprises: a. forming a dielectric layer having at least one raised portion thereof delineating a pattern corresponding to a desired conductive pattern;   b. placing a metal film in juxtaposition to said layer;   c. positioning a buffer medium proximate said film, said buffer medium having an explosive charge deposited on at least a surface thereof; and   d. detonating said explosive charge to propel said film against said layer to shear at least one portion of said film from the remainder thereof, corresponding to said delineated pattern, and to bond said sheared portion to said at least one raised portion.   
     
     
       4. A method of repairing a printed circuit pattern, which comprises: a. placing a metal film in juxtaposition to a portion of the printed circuit pattern to be repaired;   b. positioning a buffer medium proximate said film, said buffer medium having an explosive charge deposited on at least a surface thereof; and   c. detonating said explosive charge to propel said film against said portion to at least shear said film in a pattern corresponding to said portion to bond said sheared pattern to said portion to repair said portion.  .[.5. A method of forming a metallic pattern, which comprises:   a. placing a metal film in juxtaposition to a surface having a desired shape;   b. positioning a buffer medium proximate said film, said buffer medium having an explosive charge deposited on at least a surface thereof; and   c. detonating said explosive charge to propel said film against an edge of said surface at a velocity sufficient to at least shear said film in a pattern corresponding to said surface without achieving a bond to said surface..]. .Iadd. 6. The method of forming a laminate as recited in claim 1 wherein:   (a) said metal film is from 0.2 to 0.6 mil thick; and   (b) said buffer medium has an explosive charge on one surface thereof and said metal film on the opposite surface thereof..Iaddend. .Iadd. 7. The method of forming a laminate as recited in claim 6 wherein upon detonation said buffer medium separates from said sheared portions of said metal film..Iaddend..Iadd. 8. The method of positioning a metal on a discrete portion of metal pattern as recited in claim 2 wherein:   (a) said metal film is from 0.2 to 0.6 mil thick; and   (b) said buffer medium has an explosive charge on one surface thereof and said film on the opposite surface thereof..Iaddend..Iadd. 9. The method of forming a laminate as recited in claim 8 wherein upon detonation said buffer medium separates from said sheared portions of said metal film..Iaddend.