USRE29325EExpiredUtility
Hermetic power package
Priority: Jan 26, 1971Filed: Jul 16, 1973Granted: Jul 26, 1977
Est. expiryJan 26, 1991(expired)· nominal 20-yr term from priority
H10W 76/134H10W 40/70H10W 40/259
22
PatentIndex Score
7
Cited by
2
References
4
Claims
Abstract
Hermetic power packages are devices in which power-consuming chip devices or integrated circuits which generate considerable amounts of heat can be mounted and which provide thermally integral heat sinks. .Iadd.Terminal and lead-bearing alumina rings or collars, unified by firing, provide hermetically sealed insulated buried leads. .Iaddend. .Iadd.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A package adapted for a power-consuming chip device comprising: A. a metallic heat conductive base B. a low expansion metallic shim brazed to said base and, C. a .Iadd.terminal-bearing and .Iaddend.lead-bearing alumina ceramic .Iadd.ring or .Iaddend.collar .Iadd.having a central opening and .Iaddend.having metallic surfaces at least partially covering the top and bottom surfaces.[.,.]. .Iadd.and external terminals connected to internal terminals within the central opening by buried leads, .Iaddend.said .Iadd.ring or .Iaddend.collar being sealed to said base by brazing to said shim and surrounding an area of said base adapted to receive said chip device.
2. A package adapted for a power-consuming chip device according to claim 1 having a substantially central opening in the low expansion metallic shim approximately corresponding to the area surrounded in the .Iadd.terminal-bearing and .Iaddend.lead-bearing .Iadd.alumina .Iaddend.ceramic .Iadd.ring or .Iaddend.collar.
3. A package adapted for a power-consuming chip device according to claim 1, having a bilaterally metal-coated beryllia chip attached to the base within the area surrounded by the .Iadd.terminal-bearing and lead-bearing alumina .Iaddend.ceramic .Iadd.ring or .Iaddend.collar and adapted for attachment of a chip device to the base with electrical insulation and thermal conduction.
4. A package adapted for a power-consuming chip device according to claim 1 wherein a low expansion metallic ring is attached to the upper surface of the .Iadd.terminal-bearing and lead-bearing alumina .Iaddend.ceramic .Iadd.ring or .Iaddend.collar to provide a base for attachment of a covering lid.Join the waitlist — get patent alerts
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