Wafer handling apparatus and method

Abstract

Apparatus and method are disclosed for providing the transfer of a semiconductor wafer from a first to a second location. The apparatus includes a transfer arm including a plurality of apertures to facilitate the attachment of a bowed wafer, without breakage or frontside contact, to the transfer arm. The size, number and location of the apertures may be determined in accordance with the size of the wafer, the amount of bow, as well as the type of bow (i.e., simple or complex). A plurality of flexible members may be disposed in a one-to-one relationship with the apertures and utilized to achieve a secure vacuum seal of the wafer to the transfer arm.

We claim: 
     
       1. Apparatus for providing transfer of a semiconductor wafer from a first location, said apparatus including a transfer arm for attaching to said wafer, characterized in that   the transfer arm comprises a top and a bottom major surface, with a vacuum port formed therebetween, said transfer arm including a plurality of vacuum-assisted apertures for facilitating the attachment of a selected wafer to said transfer arm top major surface.   
     
     
       2. Apparatus as defined in claim 1 wherein the transfer arm further comprises flexible means disposed within each aperture to provide a vacuum seal with the selected wafer upon attachment. 
     
     
       3. Apparatus as defined in claim 2 wherein the plurality of vacuum-assisted apertures includes threaded openings and the apparatus further comprises a plurality of flexible members capable of being mated with said plurality of threaded apertures.   
     
     
       4. Apparatus for providing transfer of a semiconductor wafer exhibiting bow, said apparatus including a transfer arm for attaching to said bowed wafer characterized in that   the transfer arm comprises a top and a bottom major surface, with a vacuum port formed therebetween, said transfer arm including a plurality of vacuum-assisted apertures for facilitating the attachment of a selected bowed wafer to said transfer arm top major surface.   
     
     
       5. Apparatus as defined in claim 4 wherein said plurality of vacuum-assisted apertures comprises a number of separate apertures sufficient to provide attachment of a wafer with bow in the range of four to thirty mils. 
     
     
       6. Apparatus as defined in claim 4 wherein the transfer arm further comprises flexible means disposed within each aperture to provide vacuum sealing of the selected bowed wafer upon attachment with said transfer arm. 
     
     
       7. A method of transferring a semiconductor wafer from a first location to a second location, the method comprising the steps of: a) moving a transfer arm into the vicinity of a selected wafer, the transfer arm comprising a top and a bottom major surface with a vacuum port formed therebetween, said transfer arm including a plurality of vacuum-assisted apertures;   b) activating a vacuum source coupled to said transfer arm vacuum port;   c) attaching the selected wafer against the plurality of apertures;   d) moving the transfer arm and attached wafer to the second location; and   e) deactivating the vacuum source so as to release the selected wafer.   
     
     
       8. The method according to claim 7 wherein in performing step c), performing the further step of sealing the attaching of the wafer to the transfer arm, utilizing a plurality of flexible members associated in a one-to-one relationship with the plurality of apertures.