USD962880SActiveUtility

Heat sink for memory modules

48
Assignee: ESSENCORE LTDPriority: Aug 6, 2020Filed: Aug 6, 2020Granted: Sep 6, 2022
Est. expiryAug 6, 2040(~14 yrs left)· nominal 20-yr term from priority
Inventors:Young Suk Chung
48
PatentIndex Score
1
Cited by
25
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a heat sink for memory modules, as shown and described.

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