USD902877SActiveUtility

Packaged semiconductor module

76
Assignee: ROHM CO LTDPriority: Jun 12, 2018Filed: Dec 3, 2018Granted: Nov 24, 2020
Est. expiryJun 12, 2038(~11.9 yrs left)· nominal 20-yr term from priority
Inventors:Shigeru Hirata
76
PatentIndex Score
15
Cited by
46
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a packaged semiconductor module, as shown and described.

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