USD691974SActiveUtility

Holding pad for transferring a wafer

Assignee: OSADA HIDEYUKIPriority: Dec 22, 2011Filed: Jun 21, 2012Granted: Oct 22, 2013
Est. expiryDec 22, 2031(~5.4 yrs left)· nominal 20-yr term from priority
Inventors:Hideyuki Osada
91
PatentIndex Score
553
Cited by
17
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a holding pad for transferring a wafer, as shown and described.

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