USD658607SActiveUtility

Circuit package lid

37
Assignee: HENG STEPHENPriority: Mar 26, 2010Filed: Jun 17, 2011Granted: May 1, 2012
Est. expiryMar 26, 2030(~3.7 yrs left)· nominal 20-yr term from priority
Inventors:Stephen F. HengSanjay DandiaNikon BanouvongChia-Ken Leong
37
PatentIndex Score
3
Cited by
38
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a circuit package lid, as shown and described.

Join the waitlist — get patent alerts

Track USD658607S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.