USD494544SExpiredUtility

High density interconnection device

37
Assignee: ATI TECHNOLOGIES INCPriority: Dec 28, 2001Filed: Dec 28, 2001Granted: Aug 17, 2004
Est. expiryDec 28, 2021(expired)· nominal 20-yr term from priority
Inventors:Harjinder DulaiYen-Ming ChenColin SzetoEdward J. LaurinSteven D. DanielsJean-Francois Drolet
37
PatentIndex Score
4
Cited by
8
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design of a high density interconnection device, as shown and described.

Join the waitlist — get patent alerts

Track USD494544S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.