USD466485SExpiredUtility

Semiconductor package

87
Assignee: SHINDENGEN ELECTRIC MANUFACTUTPriority: May 23, 2001Filed: May 23, 2001Granted: Dec 3, 2002
Est. expiryMay 23, 2021(expired)· nominal 20-yr term from priority
Inventors:Kenichi MaeharaKoji Igarashi
87
PatentIndex Score
44
Cited by
18
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a semiconductor package, as shown and described.

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