USD414503SExpiredUtility

Machine for forming a semiconductor wafer film

38
Assignee: TOKYO ELECTRON LTDPriority: Sep 24, 1997Filed: Mar 20, 1998Granted: Sep 28, 1999
Est. expirySep 24, 2017(expired)· nominal 20-yr term from priority
Inventors:Susumu Katoh
38
PatentIndex Score
4
Cited by
2
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for machine for forming a semiconductor wafer film, as shown.

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