USD407382SExpiredUtility
Lid for a microelectronic package
Est. expiryOct 24, 2016(expired)· nominal 20-yr term from priority
58
PatentIndex Score
11
Cited by
5
References
1
Claims
Claims
exact text as granted — not AI-modifiedWe claim the ornamental design for a lid for a microelectronic package, as shown and described.
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