USD407380SExpiredUtility

Tape mounted heatsink package for electronic parts

15
Assignee: KYOSHIN KYOGO CO LTDPriority: Jun 10, 1997Filed: Oct 1, 1997Granted: Mar 30, 1999
Est. expiryJun 10, 2017(expired)· nominal 20-yr term from priority
Inventors:Fumihiko Hikita
15
PatentIndex Score
0
Cited by
3
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a tape mounted heatsink package for electronic parts, as shown and described.

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