USD404369SExpiredUtility

Manifold cover for use in a semiconductor wafer heat processing apparatus

Assignee: TOKYO ELECTRON LTDPriority: Aug 20, 1997Filed: Feb 2, 1998Granted: Jan 19, 1999

Est. expiryAug 20, 2017(expired)· nominal 20-yr term from priority

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exact text as granted — not AI-modified

I claim the ornamental design for a manifold cover for use in a semiconductor wafer heat processing apparatus, as shown and described.

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