USD401567SExpiredUtility

Temporary package for semiconductor dice

Assignee: MICRON TECHNOLOGY INCPriority: Apr 25, 1997Filed: Apr 25, 1997Granted: Nov 24, 1998

Est. expiryApr 25, 2017(expired)· nominal 20-yr term from priority

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exact text as granted — not AI-modified

The ornamental design for a temporary package for testing semiconductor dice, as shown and described.

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