USD355848SExpiredUtility

Package for a wafer for the welding and/or cutting of plastic tubes

Assignee: DENCO INCPriority: Jan 18, 1994Filed: Jan 18, 1994Granted: Feb 28, 1995
Est. expiryJan 18, 2014(expired)· nominal 20-yr term from priority
88
PatentIndex Score
33
Cited by
10
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a package for a wafer for the welding and/or cutting of plastic tubes, as shown and described.

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