USD338402SExpiredUtility

Individual wafer package

Assignee: EMPAK INCPriority: Jan 21, 1992Filed: Jan 21, 1992Granted: Aug 17, 1993
Est. expiryJan 21, 2012(expired)· nominal 20-yr term from priority
44
PatentIndex Score
6
Cited by
7
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for an individual wafer package, as shown and described.

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