USD326273SExpiredUtility

Heat insulating cylinder for thermal treatment of semiconductor wafers

Assignee: TEL SAGAMI LTDPriority: Jul 25, 1988Filed: Jan 25, 1989Granted: May 19, 1992

Est. expiryJul 25, 2008(expired)· nominal 20-yr term from priority

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exact text as granted — not AI-modified

The ornamental design for a heat insulating cylinder for thermal treatment of semiconductor wafers, as shown and described.

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