USD266074SExpiredUtility

Heat releasing plate for mounting semiconductor components

Assignee: SHOWA ALUMINIUM CO LTDPriority: Mar 31, 1981Filed: May 30, 1980Granted: Sep 7, 1982

Est. expiryMar 31, 2001(expired)· nominal 20-yr term from priority

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exact text as granted — not AI-modified

The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.

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