USD258281SExpiredUtility

Panel board for integrated circuit packages

Assignee: ELECTRONIC MOLDING CORPPriority: Sep 23, 1977Filed: Sep 23, 1977Granted: Feb 17, 1981
Est. expirySep 23, 1997(expired)· nominal 20-yr term from priority
Inventors:James V. Murphy
62
PatentIndex Score
8
Cited by
2
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a panel board for integrated circuit packages, substantially as shown and described.

Join the waitlist — get patent alerts

Track USD258281S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.