USD1100004SActiveUtility

Solder pad

20
Assignee: SHENZHEN HENNSERY CRAFT LTDPriority: Mar 27, 2024Filed: Mar 27, 2024Granted: Oct 28, 2025
Est. expiryMar 27, 2044(~17.6 yrs left)· nominal 20-yr term from priority
Inventors:Xiangman Chen
20
PatentIndex Score
0
Cited by
15
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a solder pad, as shown and described.

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