USD1049065SActiveUtility

Semiconductor package

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Assignee: JMJ KOREA CO LTDPriority: Jul 12, 2021Filed: Jul 12, 2021Granted: Oct 29, 2024
Est. expiryJul 12, 2041(~14.9 yrs left)· nominal 20-yr term from priority
Inventors:Yun Hwa Choi
35
PatentIndex Score
0
Cited by
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References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a semiconductor package as shown and described.

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